Chip Scale Power Converter With Inductor Substrate
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Solution Overview
Problem
Existing chip scale power converters require external discrete inductors, leading to increased component costs and PCB space usage, and complex processing for high inductance, while integrated inductors result in high costs and large packages.
Innovation Solution
A chip scale power converter package that integrates a high resistivity substrate with a planar spiral inductor, allowing a power IC to be flipped onto the inductor substrate for optimized interconnection, minimizing parasitics and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a discrete inductor is used on the printed circuit board, then the power converter circuit can be implemented, but the component cost increases and PCB space is consumed
Solution Approach 1:
The patent merges the inductor and power IC into a single integrated package. The inductor is formed on a first substrate while the power IC is mounted on a second substrate, and the two substrates are bonded together to create a unified power converter assembly. This eliminates the need for separate discrete inductor components on the PCB, reducing both component count and board space occupation.
2Area of stationary object
If an inductor is co-packaged with the power IC, then PCB space is reduced, but the package size increases and valuable PCB space is consumed
Solution Approach 1:
The patent employs a nested structure where the power IC is mounted on a second substrate that is bonded to the first substrate containing the inductor. The power IC and inductor are positioned in overlapping or adjacent configurations, allowing one component to be effectively nested within or alongside the other, maximizing space utilization while minimizing overall package footprint.
3Device complexity
If the inductor is disposed on top of the integrated circuit die, then integration is achieved, but a large die is required resulting in high cost and large package
Solution Approach 1:
The patent segments the power converter into two separate substrates: the first substrate contains the inductor, and the second substrate contains the power IC. This segmentation allows each component to be optimized independently on its own substrate, avoiding the need for a large integrated die. The substrates are then bonded together, achieving integration without requiring a single large die structure.
4Reliability
If planar magnetic layers are fabricated to achieve high inductance, then inductance is increased, but complex processing is necessary
Solution Approach 1:
The patent extracts the complex planar magnetic layer fabrication process and replaces it with a simpler inductor structure formed directly on the first substrate. The inductor is created using standard PCB or substrate fabrication techniques without requiring complex multi-layer magnetic deposition processes, thereby achieving the required inductance with simpler, more cost-effective manufacturing.
Data Source
AI summary
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.