Chip Scale Vacuum Pump with Piezoelectric Multi-Stage Actuation
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Solution Overview
Problem
Existing vacuum pump technologies are not well-suited for chip scale size and high vacuum levels, limiting the development of small, portable diagnostic and analysis systems that require effective vacuum environments with low power consumption and close-to-zero leakage sealing.
Innovation Solution
A chip scale vacuum pump structure incorporating piezoelectric or piezoceramic actuators and membranes, with a multi-stage pump and valve configuration, achieving high vacuum levels through sequential compression and minimizing 'dead' volume, utilizing piezohydraulic actuation for efficient gas handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional vacuum pump technologies are used, then vacuum environments can be achieved, but the devices are not suitable for chip scale size and high vacuum levels
Solution Approach 1:
The vacuum pump is divided into multiple pumping stages (first pump stage, second pump stage, third pump stage) with each stage having its own pump membrane and piezoelectric actuator. This segmentation allows the system to achieve high vacuum levels through sequential compression while maintaining a compact chip-scale footprint, as each stage contributes incrementally to the overall vacuum level without requiring a single large-scale component.
Solution Approach 2:
The patent implements a nested structure where multiple pump stages are arranged in series within a compact chip-scale package. The first pump stage, second pump stage, and third pump stage are nested within the same substrate, with each stage building upon the previous one to achieve progressively higher vacuum levels, similar to nested dolls where smaller elements are contained within larger ones.
2Volume of moving object
If chip scale size is achieved, then portability is improved, but vacuum capability and sealing effectiveness deteriorate
Solution Approach 1:
The patent employs flexible pump membranes and valve membranes in each pump stage that can dynamically deform to create effective seals. The pump membranes are actuated by piezoelectric elements to flex and seal against the chamber walls, while valve membranes open and close to control gas flow. These flexible thin films enable close-to-zero leakage sealing within the compact chip-scale structure, preventing harmful gas leakage without increasing device size.
3Reliability
If high vacuum levels are achieved, then diagnostic capability is improved, but power consumption increases
Solution Approach 1:
The vacuum pump operates through periodic cycles where piezoelectric actuators alternately expand and contract the pump membranes to create pumping action. The multi-stage configuration allows gas to be progressively compressed through successive periodic actions of each stage, achieving high vacuum levels through repeated incremental compression rather than requiring continuous high-power operation, thereby reducing overall power consumption.
4Reliability
If multi-stage pump configuration is used, then vacuum level is improved, but device complexity increases
Solution Approach 1:
The patent employs identical piezoelectric actuator designs and membrane structures across all three pump stages, allowing the same basic pumping unit to be replicated and stacked. This universal design approach enables the multi-stage configuration to achieve high vacuum levels while controlling complexity, as each stage uses the same proven components and fabrication processes rather than requiring unique complex mechanisms for each stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-flow rate vacuum pump with low power consumption, suitable for chip scale integration, achieving high vacuum levels and enabling small, portable diagnostic systems with reduced size and power requirements.
Implementation Method 1
The pump actuator preferably comprises a piezoelectric or piezoceramic disk capable of deforming in a convex or concave manner when a predetermined voltage is applied thereto
Implementation Method 2
The valve actuator is preferably a piezoelectric or piezoceramic disk
Data Source
AI summary
A chip scale structure fabricated from known MEMS processes is provided including a pump actuator, a pump volume, pump membrane, a valve membrane, a valve aperture, and a valve actuator. The pump actuator may include a piezoelectric or piezoceramic disk. The valve actuator may be a piezoelectric or piezoceramic disk. A manifold plate with a valve aperture is disposed between the pump membrane and the valve membrane. One or more vacuum chambers are provided along a vacuum flow path or conduit in communication with the one or more vacuum chambers. The flow path comprises an inlet port and an outlet port where the inlet port is in communication with the separately provided vacuum environment. The outlet port is in commemoration with an external environment (e.g. non or lower-vacuum environment) for exhausting gases that are pulled from the separately provided vacuum environment to a separate location.