Semiconductor Chip Seal Ring Chamfered Corner Test Structures
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Solution Overview
Problem
Conventional semiconductor chip designs face challenges in reducing void areas, such as those in seal ring chamfer triangular areas at chip corners, and in incorporating electronic test structures without compromising active area space, especially at smaller technology nodes where space is limited.
Innovation Solution
Incorporating electronic test structures within the chamfered corner areas outside the seal ring on semiconductor chips, utilizing these otherwise unused spaces for operable testing, and configuring the seal ring with chamfered corners to protect against damage during the dicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chamfered corners are provided to protect against stress induced defects during singulation, then reliability is improved, but area of the chip is reduced due to triangular void areas
Solution Approach 1:
The patent converts the previously wasted triangular corner areas into beneficial electronic test structures. By placing test structures in these chamfered corner regions, the design transforms the harmful void spaces into useful functional areas, simultaneously maintaining stress protection and increasing usable chip area for testing purposes.
Solution Approach 2:
The chamfered corner areas serve dual functions: they continue to provide stress protection during singulation while simultaneously housing electronic test structures. This multi-functionality resolves the contradiction by making the protective features also contribute to testing capabilities, eliminating the need to choose between reliability and area.
2Area of moving object
If electronic test structures are placed in active areas to reduce void space, then area utilization is improved, but reliability is compromised due to increased susceptibility to damage
Solution Approach 1:
The patent segments the chip area into distinct functional zones: the seal ring encloses the active area containing circuitry, while the chamfered corner areas outside the seal ring contain electronic test structures. This segmentation allows test structures to be placed in previously unused spaces without interfering with the protected active area, thus improving area utilization while maintaining reliability through the seal ring's protective barrier.
3Reliability
If seal ring is provided around the perimeter of the die, then protection against moisture penetration and stress damage is improved, but area of the chip is reduced
Solution Approach 1:
The patent converts the wasted space outside the seal ring into beneficial areas for electronic test structures. By utilizing the chamfered corner regions that naturally exist outside the seal ring perimeter, the design transforms previously harmful void areas into useful testing zones, thereby improving area utilization while preserving the seal ring's protective function.
Data Source
AI summary
A semiconductor chip includes an active area including a plurality of integrated circuit structures, a seal ring enclosing the active area, a corner area of the semiconductor chip that is outside of the seal ring, and an electronic test structure disposed within the corner area. Semiconductor wafers including the above-noted semiconductor chips, as well as methods for fabricating semiconductor wafers including the above-noted semiconductor chips, are also disclosed.