Chip Module Separation Pin Cover with Support Bumps
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Solution Overview
Problem
Conventional separation devices for chip modules in CoWoS processes face challenges in evenly distributing ejector pins, leading to partial detachment or damage of chip modules due to limited pin distribution, which affects the integrity and reliability of the separation process.
Innovation Solution
A separation device with a pin cover featuring an active region and idle region, equipped with ejector pins and bumps or ejector blocks, allowing for a more even distribution of contact points to support the chip module during separation, minimizing damage by reducing the contact area of ejector pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If ejector pins are distributed to avoid fragile chip regions, then chip damage is reduced, but pin distribution regions are limited and separation uniformity deteriorates
Solution Approach 1:
The pin cover surface is segmented into active region and idle region, with different functions. The active region contains ejector pin apertures for separation, while the idle region contains bump apertures for support, allowing each region to specialize in its function without interfering with the other
Solution Approach 2:
Different regions of the pin cover are given different properties: the active region has through-apertures for ejector pins that contact and push the chip module, while the idle region has bump structures that provide support contact points. This local differentiation allows the system to simultaneously achieve uniform separation and chip protection
2Object-affected harmful factors
If ejector pins are concentrated in limited regions, then chip damage from pin contact is reduced, but separation completeness deteriorates due to incomplete detachment
Solution Approach 1:
Bump structures serve as intermediary support elements between the pin cover and chip module. These bumps provide contact points in the idle region that support the chip module during separation without causing damage, while allowing ejector pins in the active region to effectively push and detach the adhesive film
3Object-affected harmful factors
If ejector pins push against limited regions only, then fragile chip regions are protected, but chip module deflection occurs due to uneven force distribution
Solution Approach 1:
The bump structures act as counterbalancing support points that compensate for the limited ejector pin distribution. By providing additional contact points in the idle region, the bumps balance the force distribution across the chip module, preventing deflection while maintaining protection of fragile regions
Data Source
AI summary
A separation device is provided and includes: a pin cover having an action platform and an accommodating space for an object to be separated to be placed on the action platform, where the action platform is defined with an active region and an idle region, the active region is provided with a plurality of first apertures, and the plurality of first apertures penetrate through the action platform and communicate with the accommodating space; an ejector pin plate disposed in the accommodating space; a plurality of ejector pins disposed on the ejector pin plate and corresponding to positions of the plurality of first apertures; and a plurality of bumps disposed in the idle region of the action platform, so that the bumps can provide sufficient support for the object to be separated without hindering the separation operation of the ejector pins.