Chip Heat Dissipation Cover on Die Sidewalls and Back Surface
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Solution Overview
Problem
Conventional chip designs face challenges in heat dissipation efficiency, generation of metal debris during dicing, and separation of the heat dissipation cover from the die.
Innovation Solution
A chip structure and manufacturing method where a heat dissipation cover is formed on the back and lateral surfaces of each die after dicing, using a design with a first portion on the back surface, a second portion on the lateral surface, and a connection portion at the outer corner, preventing metal debris generation and enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation layer is formed on the backside of the wafer before dicing, then heat dissipation performance is improved, but metal debris is generated during dicing and may contaminate the carrier and die surfaces
Solution Approach 1:
The heat dissipation cover is formed on the back surface and lateral surface of each die before the dicing process. This preliminary formation allows the heat dissipation structure to be in place before cutting, eliminating the generation of metal debris during dicing while maintaining heat dissipation functionality.
2Area of stationary object
If a heat dissipation layer is diced together with the wafer, then the heat dissipation area is restricted to match the back surface area, but heat dissipation efficiency is limited
Solution Approach 1:
The heat dissipation cover extends from the back surface onto the lateral surface of each die, utilizing the third dimension (vertical/side surface) in addition to the back surface area. This dimensional extension increases the total heat dissipation area without being constrained by the dicing process, thereby improving heat dissipation efficiency.
3Device complexity
If the heat dissipation layer is formed before dicing, then the structure is simplified, but stress during dicing causes the heat dissipation sheets to separate from the dies
Solution Approach 1:
The heat dissipation cover is formed on each individual die after dicing rather than on the entire wafer before dicing. This timing change eliminates the stress-induced separation problem during dicing while maintaining structural simplicity through direct formation on the finished dies.
4Object-generated harmful factors
If the heat dissipation cover is formed after dicing on individual dies, then metal debris generation is avoided, but the manufacturing process becomes more complex
Solution Approach 1:
The heat dissipation cover is segmented and formed on each individual die after dicing rather than as a single continuous layer before dicing. This segmentation approach eliminates metal debris generation during cutting while the direct formation process keeps manufacturing complexity manageable.
Data Source
AI summary
In a method of manufacturing a chip structure, a first carrier is attached on a back surface of a wafer, the wafer is diced into individual dies and there is a groove formed between the adjacent dies, then a second carrier is attached on an active surface of the wafer and the first carrier is removed to expose the groove, a back surface and a lateral surface of each of the dies, a heat dissipation cover is formed on the back surface and the lateral surface of each of the dies to obtain chip structures. The heat dissipation cover is provided to increase heat dissipation efficiency of the dies and prevent formation of metal debris which may contaminate the dies. Furthermore, the heat dissipation cover is prevented from being separated from the die.