Semiconductor Package Sidewall Heat Dissipation for Dense Chip Stacks
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Solution Overview
Problem
As semiconductor chips become more miniaturized and integrated, effective heat dissipation systems are required to manage the heat generated by these packages efficiently.
Innovation Solution
A semiconductor package design featuring a first interconnection structure with a heat dissipation structure surrounding the semiconductor chips, utilizing materials with higher thermal conductivity than silicon, and an encapsulant to enhance heat dissipation without increasing the package's area or thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are miniaturized and integrated to increase degree of integration, then productivity and functionality are improved, but heat dissipation becomes more difficult and heat accumulation increases
Solution Approach 1:
The patent introduces a heat dissipation structure that extends in the vertical dimension (thickness direction) rather than only in the horizontal plane. The heat dissipation structure includes a first portion covering the semiconductor chip and a second portion extending downward from the first portion into the substrate, creating a three-dimensional heat dissipation pathway that resolves the contradiction by adding a vertical dimension for heat dissipation while maintaining high integration in the horizontal plane.
2Temperature
If heat dissipation structure is added to improve heat dissipation characteristics, then temperature control is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the heat dissipation structure with the substrate by forming the heat dissipation structure within the substrate itself. The second portion of the heat dissipation structure is integrated into the substrate, and the interconnection structure is formed within grooves of the substrate, combining multiple functions (heat dissipation, electrical interconnection, and structural support) into a unified integrated structure that reduces overall device complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, contains the interconnection structure for electrical connections, and incorporates the heat dissipation structure for thermal management. This multi-functionality reduces the need for separate components and simplifies the overall device architecture.
3Temperature
If heat dissipation structure is added to improve heat dissipation characteristics, then temperature control is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming grooves in the substrate before forming the heat dissipation structure. The grooves are pre-defined in the substrate, providing a template that guides the subsequent formation of the heat dissipation structure and interconnection elements. This preliminary structuring simplifies the manufacturing process and reduces precision requirements for subsequent steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively radiates heat generated by the semiconductor chips over a larger area, improving heat dissipation characteristics while maintaining the package's size and thickness.
Implementation Method 1
a heat dissipation structure surrounding side surfaces of the second semiconductor chip, the heat dissipation structure on an upper surface of the first semiconductor chip and including a material having higher thermal conductivity than a thermal conductivity of silicon
Data Source
AI summary
A semiconductor package includes a first interconnection structure, a first semiconductor chip disposed on the first interconnection structure and including a plurality of through-vias and first pads connected to the plurality of through-vias; a second semiconductor chip disposed on the first interconnection structure, including second pads electrically connected to the first pads, and having a size different from a size of the first semiconductor chip; a heat dissipation structure contacting and surrounding side surfaces of at least one of the first semiconductor chip and the second semiconductor chip, and including a material having higher thermal conductivity than a thermal conductivity of silicon; and an encapsulant surrounding side surfaces of the heat dissipating structure.