Chip Socket Air-Floating for Precise Thin-Chip Positioning
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Solution Overview
Problem
Thin and light chips are prone to damage and improper positioning during transfer due to external forces and air flow issues, leading to difficulties in accurately placing them into chip sockets.
Innovation Solution
A chip transfer device with a chip carrier, air pressure switching valve, and control unit that uses positive and negative air pressures to float and position chips, ensuring accurate placement and secure holding within the chip sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the pick-and-place device directly presses the chip into the chip socket, then the chip positioning speed is improved, but the chip may be crushed and damaged
Solution Approach 1:
The patent employs pneumatic pressure through a pressure source connected to the chip socket to press the chip into place. This replaces mechanical direct pressing with pneumatic force, allowing controlled pressure application that prevents chip crushing while achieving proper positioning. The pneumatic system provides distributed force across the chip surface rather than concentrated mechanical pressure.
2Manufacturing precision
If the chip is released at a certain height to drop into the chip socket, then the chip positioning accuracy is improved, but the chip swings during dropping due to vortex formation
Solution Approach 1:
The patent uses pneumatic pressure applied through the chip socket to hold and position the chip during transfer. This pneumatic support eliminates the dropping motion that causes vortex formation and swinging, while still achieving accurate positioning. The controlled pneumatic pressure keeps the chip stable throughout the transfer process.
Solution Approach 2:
The pneumatic pressure system provides an upward force that counteracts gravity during chip transfer. This prevents the chip from dropping and eliminates the unstable motion caused by free fall, while maintaining precise positioning control through regulated pressure application.
3Ease of operation
If chamfers are provided on the chip socket edges to guide chip insertion, then the chip insertion is facilitated, but friction force may stick the chip on the chamfer
Solution Approach 1:
The patent replaces the chamfer-guided mechanical insertion with pneumatic pressure application. The pressure source applies force through the chip socket bottom, eliminating the need for chamfer edges and the associated friction problems. This pneumatic method provides smooth chip movement without sticking while maintaining precise positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables precise and secure positioning of chips by air-floating them into sockets, reducing offset and ensuring firm fixation, even during transfer, while simplifying equipment design and reducing assembly and maintenance costs.
Implementation Method 1
an air flow which flows through the at least one vent hole from the positive air pressure source blows a lower surface of the at least one chip, so that the at least one chip is air-floated
Implementation Method 2
the control unit controls the air pressure switching valve to allow the at least one vent hole to be communicated with the negative air pressure source, so that the negative pressure source generates negative pressure to vacuum suck the chip
Data Source
AI summary
The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.