Chip Socket Assembly With Central Support to Prevent Contact Gaps
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Solution Overview
Problem
Conventional chip assembly methods often result in gaps between the chip socket and the circuit board, leading to unreliable electrical contact and reduced stability of the connection, due to uneven clamping forces and stress concentration on the circuit board.
Innovation Solution
The proposed solution involves a chip assembly design with a first clamping member, a chip, a chip socket, and a second clamping member, where the second clamping member has a protruding portion that supports the circuit board, ensuring close contact between the chip and the chip socket or between the chip socket and the circuit board, and includes a plate-like member with a curved surface to distribute force evenly and avoid stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional screws are loaded at four corners to fasten the chip assembly, then the assembly can be secured, but gaps form between the middle position of the chip socket and the circuit board, reducing contact reliability
Solution Approach 1:
The support function is segmented between the four corner screws and the additional protruding portion in the middle area. The protruding portion divides the support into multiple zones, with corner support from screws and central support from the protruding portion, preventing gap formation in the middle area while maintaining overall assembly stability
Solution Approach 2:
The protruding portion acts as an intermediary support element between the chip socket and the circuit board. It mediates the contact in the middle area where gaps would otherwise form, providing additional support without interfering with the corner screw fastening mechanism
2Reliability
If conventional plate-like members are used without protruding portions, then the structure is simple, but stress concentrates on the circuit board, reducing connection stability
Solution Approach 1:
The protruding portion creates a local quality change in the plate-like member, adding structural support specifically in the middle area where stress concentration occurs. This localized modification distributes stress more evenly across the circuit board without changing the overall simple plate structure
Solution Approach 2:
The protruding portion introduces a curved or elevated surface feature on the otherwise flat plate-like member. This curvature allows for better stress distribution by creating a gradual transition zone that reduces stress concentration points on the circuit board
Data Source
AI summary
A chip assembly has a first clamping member, a chip, a chip socket, a circuit board, and a second clamping member in a sequentially stacked manner. The chip is electrically connected to the circuit board through the chip socket, and at least one side of the chip socket is in electrical contact with the chip or the circuit board. The chip assembly further comprises a plurality of first fasteners disposed around the chip and configured to lock the first clamping member and the second clamping member. The second clamping member has a protruding portion extending in a direction towards the first clamping member and located in an area enclosed by the first fasteners, and a part of an orthographic projection area of the protruding portion on the circuit board is located in an orthographic projection area of the chip on the circuit board.