Chip Socket Jet Cooling Through Divergent Openings for Reliable Testing
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Solution Overview
Problem
The increasing heat generation during chip testing due to improved chip performance leads to overheating issues, potentially damaging the chip socket and testing equipment, and causes solder ball softening and scattering, resulting in test failures and short circuits.
Innovation Solution
A chip cooling module that directs cooling fluid through divergent openings in a socket to form a jet stream, cooling both the lower and upper surfaces of the chip, and includes fluid discharge channels to maintain cleanliness and remove debris.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip performance is improved, then chip functionality and speed are enhanced, but heat generation increases causing overheating of chip socket and testing equipment
Solution Approach 1:
The patent extracts the heat removal function from the chip socket structure by introducing a separate fluid channel system. The fluid channels are integrated into the socket but function independently to carry cooling fluid away from the heat generation area, effectively separating the testing function from the thermal management function.
Solution Approach 2:
The patent introduces cooling fluid as an intermediary substance between the heat source (chip and socket) and the environment. The fluid acts as a heat transfer medium, absorbing thermal energy from the chip socket through conduction and convection, then carrying it away to be dissipated elsewhere in the system.
2Productivity
If chip temperature exceeds 100°C, then testing can proceed, but solder balls soften and melt causing adhesion to probe or scattering within test socket
Solution Approach 1:
The patent implements preliminary cooling action by establishing fluid channels that actively remove heat before the chip temperature can reach the critical 100°C threshold. The cooling system is designed to maintain temperatures below this threshold throughout the testing process, preventing solder ball softening before it occurs.
Solution Approach 2:
The patent converts the harmful heat generation inherent in high-performance chip testing into a manageable thermal flow that can be systematically removed. By designing the fluid channels to follow the heat flow path, the system transforms the problematic thermal energy into a controlled convection current that carries heat away from sensitive areas.
3Temperature
If cooling fluid is supplied through fluid channel, then chip slot is cooled, but fluid flow path and debris removal needs create structural complexity
Solution Approach 1:
The patent merges multiple functions into the socket structure: the chip slot accommodation, the fluid channel for cooling, and the debris collection capability are all integrated into a single socket component. This consolidation reduces the number of separate parts while maintaining all necessary functions, thereby managing structural complexity.
Solution Approach 2:
The socket is designed as a multi-functional component that simultaneously performs mechanical support for the chip, thermal management through fluid channels, and debris collection. This universal design approach allows a single component to handle multiple aspects of chip testing, reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools the chip and socket, preventing overheating and maintaining cleanliness, thereby reducing the risk of damage and improving test reliability.
Implementation Method 1
the cooling fluid forms a jet stream toward the chip slot through the divergent opening
Implementation Method 2
cooling fluid flows through a fluid accommodating space formed by a lower surface of a chip and a chip slot to cool the chip slot
Data Source
AI summary
A chip cooling module and a chip testing apparatus having the same are provided. The chip cooling module includes a socket and a fluid supply device. The socket includes a chip slot and at least one fluid channel, and the chip slot is configured to accommodate a chip. The fluid supply device is in communication with the at least one fluid channel of the socket. The at least one fluid channel includes a divergent opening, and the divergent opening is provided on a sidewall of the socket and faces the chip slot. In response to the fluid supply device supplying a cooling fluid to the at least one fluid channel, the cooling fluid forms a jet stream toward the chip slot through the divergent opening.