Semiconductor Chip Solder Alignment Using Annular Resin Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device manufacturing methods are costly and inefficient due to the need for dedicated jigs to position semiconductor chips and solder, especially for varied chip shapes and arrangements, leading to high production costs and low productivity.
Innovation Solution
A method involving the formation of annular alignment resins on electrodes, with thinner plate solder arranged inside, allowing for solder positioning without dedicated jigs, enabling cost reduction and improved productivity by using the alignment resin to position the solder and semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dedicated carbon jigs are used to position semiconductor chips and plate solder, then positioning precision is improved, but production cost increases and productivity decreases
Solution Approach 1:
The solder resist pattern on the insulating substrate serves dual functions: it acts as both the positioning reference and the bonding structure. The plate solder is positioned by aligning with the solder resist pattern itself, eliminating the need for separate positioning jigs. This self-service approach allows multiple chip types to be positioned using the same substrate pattern, improving productivity while maintaining positioning precision through the standardized resist design.
Solution Approach 2:
The solder resist pattern is designed to serve multiple purposes: positioning reference for various chip types, bonding structure for solder attachment, and wetting control for melted solder. This multi-functional design eliminates the need for dedicated jigs for each chip type, allowing a single substrate design to accommodate different semiconductor chip shapes and arrangements, thereby improving productivity without sacrificing positioning accuracy.
2Manufacturing precision
If dedicated carbon jigs are used to position semiconductor chips and plate solder, then positioning precision is improved, but production cost increases
Solution Approach 1:
The solder resist pattern on the insulating substrate serves dual functions: it acts as both the positioning reference and the bonding structure. The plate solder is positioned by aligning with the solder resist pattern itself, eliminating the need for separate positioning jigs. This self-service approach allows multiple chip types to be positioned using the same substrate pattern, improving productivity while maintaining positioning precision through the standardized resist design.
Solution Approach 2:
The solder resist is a thin, inexpensive layer that can be easily fabricated using standard photolithography processes. Instead of using expensive, reusable carbon jigs that require separate fabrication for each chip type, the patent uses a cheap, integrally-fabricated resist pattern that serves the positioning function. This disposable-like approach (where the resist is consumed in the bonding process) significantly reduces tooling costs while maintaining positioning accuracy.
3Reliability
If plate solder thickness is increased to ensure proper bonding, then bonding reliability is improved, but positioning precision deteriorates due to solder spreading
Solution Approach 1:
The solder resist is designed with varying thickness in different regions: thicker at the edges to prevent solder spreading and maintain positioning precision, and thinner in the center to allow proper wetting and bonding. This local quality variation ensures that the solder remains contained within the resist boundaries (maintaining positioning precision) while still achieving reliable bonding through adequate wetting in the bonding area.
Solution Approach 2:
The patent controls the thickness parameter of the solder resist to optimize both positioning precision and bonding reliability. By setting the resist thickness to be greater than the plate solder thickness, the solder is physically constrained within the resist boundaries, preventing spreading. Simultaneously, the resist thickness is optimized to allow proper wetting of the solder, ensuring bonding reliability without compromising positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and enhances productivity by eliminating the need for dedicated jigs, allowing for flexible positioning of semiconductor chips and ensuring reliable soldering without warpage issues, while enabling the use of high-temperature, high-voltage, and high-current-density semiconductor devices.
Implementation Method 1
making the first plate solder to melt to bond a lower surface of the semiconductor chip to the electrode
Data Source
AI summary
A first alignment resin (4) is formed in an annular shape on an electrode (3) of an insulating substrate (1). First plate solder (5) having a thickness thinner than that of the first alignment resin (4) is arranged on the electrode (3) on an inner side of the annular shape of the first alignment resin (4). A semiconductor chip (6) is arranged on the first plate solder (5). The first plate solder (5) is made to melt to bond a lower surface of the semiconductor chip (6) to the electrode (3).