Chip Solder Mounting for Precise Solder Amount Control
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Solution Overview
Problem
Existing component mounting technologies face difficulties in accurately designating and mounting chip solder of appropriate sizes on a board, leading to inefficiencies in supplementing insufficient solder amounts for large-sized components.
Innovation Solution
A component mounting apparatus and method that includes a control unit to instruct and mount chip solder of specific sizes on each electrode of the board based on production data, ensuring appropriate soldering for both large and small component terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If chip solder is mounted on a board to supplement insufficient solder amount, then the solder amount for bonding component terminals is improved, but the complexity of designating and mounting appropriate sizes of chip solder on a vast multitude of lands increases
Solution Approach 1:
The patent applies parameter changes by utilizing production data that specifies the size of chip solder to be mounted on each electrode. The control unit automatically selects and mounts chip solder of appropriate sizes based on predetermined parameters stored in the production data, eliminating the need for manual designation and simplifying the mounting process while ensuring adequate solder quantity for each land.
2Manufacturing precision
If a thin metal mask is used to cope with printing defect, then the solder spreading is improved, but the solder amount supplied to the land becomes insufficient for large-sized components
Solution Approach 1:
The patent merges two soldering approaches by combining the use of a thin metal mask for precise solder spreading with the addition of chip solder to supplement the solder amount. The control unit coordinates both processes, allowing the thin mask to ensure proper solder distribution while chip solder provides the additional quantity needed for large-sized component terminals.
Data Source
AI summary
A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.