Chip Solder Mounting for Precise PCB Bonding
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Solution Overview
Problem
Existing component mounting technologies face difficulties in accurately designating and mounting chip solder of appropriate sizes on a board, leading to inefficiencies in supplementing insufficient solder amounts for large components.
Innovation Solution
A component mounting apparatus and method that includes a mounting unit, a component supply unit for chip solder, and a control unit that uses production data to instruct the size of chip solder for each component terminal, enabling precise placement of chip solder on the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin metal mask is used to cope with miniaturization and narrow pitches, then printing defect due to deterioration in spreading is reduced, but the solder amount supplied to each land becomes insufficient for large-sized components
Solution Approach 1:
The solution segments the solder supply process into two distinct stages: first, cream solder is printed through the thin metal mask to ensure precise positioning; second, chip solder is mounted separately to supplement the solder amount. This segmentation allows the thin mask to fulfill its precision function while the additional chip solder compensates for the reduced quantity.
Solution Approach 2:
The cream solder is printed in advance through the thin metal mask before component mounting, establishing a precise baseline solder pattern. Then, chip solder is mounted as a supplementary action to ensure adequate total solder amount, particularly for large-sized components with multiple terminals.
2Quantity of substance
If multiple types of chip solder are prepared to supplement insufficient solder amount, then solder amount deficiency is addressed, but it becomes difficult to designate and mount appropriate sizes on a vast multitude of lands
Solution Approach 1:
The system uses parameter changes in the production data to control chip solder mounting. The production data includes instructions specifying the size of chip solder to be mounted on each component terminal, allowing the mounting apparatus to automatically select and mount the appropriate chip solder size without complex manual intervention or additional hardware complexity.
Solution Approach 2:
Production data serves as an intermediary that bridges the component terminal requirements and the chip solder selection process. The production data contains size instructions for each terminal, enabling the control system to automatically determine which chip solder size to mount without requiring complex real-time decision-making or additional sensing mechanisms.
3Reliability
If chip solder is mounted on all lands to ensure adequate solder amount, then solder bonding reliability is improved, but mounting time and process complexity increase
Solution Approach 1:
The system applies local quality by providing different solder solutions to different locations based on their specific needs. Chip solder is mounted only on lands where the cream solder amount is insufficient, particularly for large-sized components, while smaller components receive only cream solder. This localized approach ensures reliability where needed without unnecessarily increasing mounting time for all components.
Data Source
AI summary
A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.