Chip Heat Dissipation Structure With Ti-NiV-Au Solderable Plating
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Solution Overview
Problem
Conventional thermal grease used in chip heat dissipation has a low thermal conductivity, leading to unsatisfactory heat dissipation effects, and solder with higher thermal conductivity cannot be effectively welded to the plastic package structure of the chip.
Innovation Solution
A chip heat dissipation structure featuring a plating layer with sequentially arranged titanium, nickel-vanadium alloy, and gold metal layers, which allows a solder layer of tin to weld a heat sink, providing higher thermal conductivity and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal grease is used to paste the heat sink on the chip, then the chip can be mounted with a heat sink, but the thermal conductivity is lower than 2 W/(m·C) leading to unsatisfactory heat dissipation effect
Solution Approach 1:
The patent changes the material parameter from conventional thermal grease to a multi-layer metal plating structure (Ti/NiV/Au) with significantly higher thermal conductivity, transforming the thermal interface material from organic adhesive to metallic conductor to resolve the heat dissipation bottleneck
Solution Approach 2:
The patent employs a composite multi-layer metal plating structure combining titanium, nickel-vanadium alloy, and gold layers, where each layer contributes different properties (adhesion, thermal conductivity, corrosion resistance) to achieve superior overall heat dissipation performance compared to single-material solutions
2Loss of energy
If solder with higher thermal conductivity is used, then thermal conductivity improves, but solder cannot be effectively welded to the plastic package structure of the chip
Solution Approach 1:
The patent applies different metal layers with different local functions: titanium layer for adhesion to plastic package structure, nickel-vanadium alloy layer for high thermal conductivity, and gold layer for corrosion resistance and solderability, ensuring each interface has the optimal material properties for its specific requirement
Solution Approach 2:
The multi-layer metal plating acts as an intermediary between the plastic package structure and the solder, where the titanium layer provides adhesion to plastic, the nickel-vanadium layer provides thermal conductivity, and the gold layer provides solderability, thus enabling effective thermal interface without direct solder-to-plastic welding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency by using metal layers with higher thermal conductivity than epoxy adhesive materials, preventing heat damage to the chip and improving overall heat dissipation performance.
Implementation Method 1
a metal layer have a higher thermal conductivity than an epoxy adhesive material mounted on a conventional heat sink, which solves a problem of a bottleneck of heat dissipation of the adhesive material in the chip
Implementation Method 2
the heat sink is welded on the plating layer through a solder layer
Data Source
AI summary
Embodiments of the present application relates to a chip heat dissipation structure, a chip structure, a circuit board, and a supercomputing device, and the chip heat dissipation structure includes: a plating layer covering a wafer of the chip; where the plating layer includes a first metal layer, a second metal layer, and a third metal layer sequentially arranged. Three metal layers are added on a top of the chip by physical sputtering, so that a heat sink can be welded on the metal layers by a solder layer, and then the heat sink is fixed on the top of the chip; a main component of the solder layer is metal tin, and the metal layer have a higher thermal conductivity than an epoxy adhesive material mounted on a conventional heat sink.