Chip Spacer Intermetallic Structure for Acoustic Noise Control
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Solution Overview
Problem
Existing chip electronic components, such as multilayer ceramic capacitors, face challenges in attaching spacers to compact components without shifting or rotating, and these spacers often fail to maintain configuration during soldering due to high temperatures.
Innovation Solution
The use of spacers made from an intermetallic compound containing high-melting-point metals like Cu and Ni, along with Sn as a low-melting-point metal, which are applied as a paste and heated to form a stable configuration that maintains heat resistance and desired positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If blocks are disposed at predetermined positions on the chip electronic component to provide spacers, then acoustic noise is suppressed, but the blocks shift to undesired positions or rotate in undesired directions
Solution Approach 1:
The spacer is divided into multiple segments (first spacer and second spacer) that are disposed at different positions on the component body. Each segment independently suppresses acoustic noise from different outer electrodes, while the segmented structure reduces mutual interference and positioning complexity compared to a single large spacer.
Solution Approach 2:
The spacers are formed by applying solder paste to predetermined positions and subjects it to reflow treatment before mounting. This preliminary formation of spacers at exact predetermined positions ensures accurate positioning, and the spacers maintain their configuration during subsequent mounting processes.
2Object-affected harmful factors
If spacers are made of conductive resin to suppress acoustic noise, then acoustic noise is reduced, but the spacers cannot withstand soldering temperature
Solution Approach 1:
The material of the spacers is changed from conductive resin to solder material (intermetallic compound) with high melting point. This parameter change enables the spacers to withstand soldering temperatures while maintaining their acoustic noise suppression function, as the solder material remains stable at elevated temperatures.
Solution Approach 2:
The spacer is formed as an intermetallic compound containing both high-melting-point metals (Cu, Ni) and low-melting-point metal (Sn), creating a composite material that combines heat resistance with acoustic noise suppression capabilities. This composite structure allows the spacer to function effectively during soldering processes.
3Ease of manufacture
If solder paste is applied to form spacers using lead-free solder, then positioning is easier, but the solder spreads out or dewets during reflow process
Solution Approach 1:
The composition of the solder paste is optimized to contain specific ratios of high-melting-point metal particles (Cu, Ni) and low-melting-point metal (Sn). This parameter change in material composition prevents spreading and dewetting during reflow, as the intermetallic compound formation maintains configuration accuracy while allowing easy application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for easy and accurate disposition of spacers on chip electronic components, reducing acoustic noise and ensuring high heat resistance, even at soldering temperatures, thereby improving the mounting process and component performance.
Implementation Method 1
The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining and functioning as a low-melting-point metal
Implementation Method 2
ensuring high heat resistance, even at soldering temperatures
Data Source
AI summary
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.