3D Chip Stack Interconnect Structure for Ultra-Thin Die Alignment
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Solution Overview
Problem
The complexity and fragility of ultra-thin chips in 3D integration technology lead to increased costs and difficulties in accurate alignment, making current chip stack packaging methods inefficient for miniaturization and interconnection.
Innovation Solution
A chip stack packaging structure and method involving a base chip layer, stacked chip layers with inter-chip insulating layers, and a top insulating layer, where vertical interconnection holes with conductive material layers facilitate electrical connections between pins, and a barrier layer prevents material diffusion, enabling precise and cost-effective ultra-thin multi-chip packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TSV silicon through holes are formed in advance on each chip to enable 3D integration, then interconnection between multi-layer chips is achieved, but the operation becomes complicated and alignment accuracy deteriorates
Solution Approach 1:
The patent applies preliminary action by forming TSV holes and preparing interconnection structures on chips before the stacking process. This allows the chips to be stacked with simpler alignment requirements, as the complex interconnection formation is already completed on each chip individually before assembly, rather than requiring precise alignment during the stacking process itself.
2Volume of moving object
If chips are thinned to achieve further miniaturization in 3D integration, then chip size is reduced, but chip fragility increases and handling becomes difficult
Solution Approach 1:
The patent applies beforehand cushioning by providing a support structure or carrier substrate that holds the thinned chips during the stacking and assembly process. This support structure compensates for the reduced mechanical strength of thinned chips, preventing breakage during handling while allowing the final product to achieve the desired miniaturization.
3Volume of moving object
If ultra-thin chips are used to achieve miniaturization, then chip volume is reduced, but handling difficulty and cost increase
Solution Approach 1:
The patent applies the intermediary principle by introducing a carrier substrate or support structure that mediates between the ultra-thin chips and the handling/assembly processes. This intermediary provides mechanical support during manufacturing operations, making handling easier while allowing the ultra-thin chips to achieve the desired miniaturization in the final stacked product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-accuracy, low-cost ultra-thin multi-chip packaging by ensuring robust chip handling and precise electrical connections, addressing the challenges of chip fragility and alignment in 3D integration.
Implementation Method 1
a conductive material layer is formed inside the vertical interconnection hole to electrically connect the corresponding pins
Implementation Method 2
a barrier layer is formed between the inner wall of the vertical interconnection hole and the conductive material layer to prevent material forming the conductive material layer from entering the inside of the inter-chip insulating layer
Data Source
AI summary
A chip stack packaging structure and method includes: a base chip layer, including a base chip with pins on the front surface; at least one stacked chip layer, which is formed on the base chip layer, has an inter-chip insulating layer and at least one stacked chip attached to the insulating layer and pins on the front surface, where the front surface of the stacked chip faces the front surface of the base chip; and a top insulating layer, stacked on the stacked chip layer farthest from the base chip layer. A vertical interconnection hole is formed inside the inter-chip insulating layer to allow the corresponding pins to be communicated vertically so as to be electrically connected. Inside the vertical interconnection hole, a conductive material layer is formed that makes the corresponding pins electrically connected; the stacked chip is thinned and reduced after being attached to the inter-chip insulating layer.