Chip Stack Package Structure With Integrated Thermal Enhancement
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Solution Overview
Problem
Existing semiconductor packages face challenges in heat dissipation performance, which is critical for efficient operation of electronic devices.
Innovation Solution
A package structure is developed that includes a thermal enhance component, such as a heat sink, integrated with a chip stacking structure through conductive through vias and redistribution circuit structures, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal enhance component is integrated with chip stacking structure, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the thermal enhance component with the chip stacking structure into an integrated package structure. The heat sink is coupled to the semiconductor dies through conductive through vias, merging thermal management functionality with the structural support function, thereby improving heat dissipation while maintaining structural integrity without requiring separate independent thermal management systems
Solution Approach 2:
The conductive through vias serve multiple functions: they provide structural support for the chip stacking structure, enable electrical connectivity between redistribution circuit structures, and facilitate thermal conduction from the semiconductor dies to the heat sink. This multi-functionality reduces the need for separate dedicated components, managing complexity while achieving thermal enhancement
2Temperature
If thermal enhance component is added to manage heat, then heat dissipation performance is improved, but manufacturing complexity increases
Solution Approach 1:
The package structure is divided into distinct functional layers: semiconductor dies, redistribution circuit structures, conductive through vias, and thermal enhance component. This segmentation allows each component to be manufactured and prepared separately using specialized processes, then assembled together, making the complex thermal management system more manufacturable by breaking it into manageable segments
Solution Approach 2:
The conductive through vias are formed by nesting multiple functional elements within a single structural feature. The vias contain both electrical conductive material and thermal conductive pathways, embedding multiple functions within a single manufactured feature. This nesting reduces the number of separate manufacturing steps and assembly operations required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance, ensuring effective operation of semiconductor devices by managing thermal energy efficiently.
Implementation Method 1
a thermal enhance component... thermally coupled to the chip stacking structure... enhancing thermal management
Data Source
AI summary
A package structure including a chip stacking structure, a thermal enhance component and a first dielectric material is provided. The thermal enhance component is stacked over and thermally coupled to the chip stacking structure, wherein a first lateral dimension of the thermal enhance component is greater than a second lateral dimension of the chip stacking structure. The first dielectric material laterally encapsulates the thermal enhance component and the chip stacking structure.