Chip Stacking Package Structure With Integrated Thermal Enhancement
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving effective heat dissipation and efficient chip stacking, which are crucial for the performance and reliability of electronic devices.
Innovation Solution
The proposed solution involves a process flow for fabricating chip stacking structures and Package-on-Package (PoP) structures that include the use of thermal enhance components, such as heat sinks, and advanced bonding techniques to enhance thermal management and mechanical support, while maintaining a compact package form-factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal enhance components are added to improve heat dissipation, then thermal management performance is improved, but device complexity increases
Solution Approach 1:
The thermal enhance component is integrated within the package structure by nesting it alongside the chip stacking structure. The insulating encapsulant encapsulates both the chip stacking structure and the thermal enhance component, creating a nested configuration where the thermal management function is embedded within the existing package architecture rather than adding external components.
Solution Approach 2:
The package structure is designed to serve multiple functions simultaneously: the chip stacking structure provides electrical connectivity and computing functionality, while the thermal enhance component provides heat dissipation. The insulating encapsulant provides both mechanical protection and thermal isolation. This multi-functionality approach allows the package to address both computational and thermal management requirements within a single integrated structure.
2Productivity
If chip stacking structure is used to increase integration density, then productivity is improved, but thermal resistance increases
Solution Approach 1:
The thermal enhance component acts as an intermediary between the stacked chips and the external environment. It provides a dedicated thermal conduction path that mediates the heat transfer from the high-density chip stacking structure to the outside, preventing heat accumulation within the stacked configuration and enabling effective thermal management despite the increased integration density.
3Volume of moving object
If compact package form-factor is maintained, then device miniaturization is achieved, but thermal management becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by stacking chips vertically and introducing a thermal enhance component that extends in the vertical dimension. This dimensional change allows heat to be conducted away from the chip stack in the vertical direction rather than relying solely on lateral heat paths, enabling effective thermal management within a compact volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides improved thermal enhancement and mechanical support, reducing thermal resistance and crack risks, and enabling efficient heat dissipation and electrical connectivity between stacked semiconductor dies.
Implementation Method 1
a thermal enhance component... thermally coupled to the chip stacking structure... reducing thermal resistance
Implementation Method 2
a first insulating encapsulant laterally encapsulates the chip stacking structure and the thermal enhance component... providing mechanical support
Data Source
AI summary
A package structure including a chip stacking structure, a thermal enhance component and a first insulating encapsulant is provided. The thermal enhance component is stacked over and thermally coupled to the chip stacking structure, wherein a first lateral dimension of the thermal enhance component is greater than a second lateral dimension of the chip stacking structure. The first insulating encapsulant laterally encapsulates the thermal enhance component and the chip stacking structure.