Automated Chip Strength Testing Apparatus with Conveying and Pick-up Mechanisms

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Solution Overview

Problem

Manual handling of chips during strength measurement in semiconductor wafers leads to labor-intensive operations and variability in testing conditions, resulting in reduced accuracy.

Innovation Solution

A testing apparatus with a cassette mounting base, frame fixing mechanism, conveying mechanism, pushing-up mechanism, pick-up mechanism, strength measuring mechanism, and collect moving mechanism, which automates the process of picking up and placing chips for measurement, reducing manual intervention and variability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual handling of chips is used for strength measurement, then the operation is simple, but the labor required increases and variability in testing conditions occurs

Engineering Contradiction:

Improvesimplicity of operationVSAvoidtesting efficiency

Core Design Contradiction:

Ease of operationVSProductivity

Solution Approach 1:

The testing apparatus automatically performs chip pickup, conveyance, and placement operations without human intervention. The pick-up mechanism collects chips from the wafer, the conveying mechanism transports them, and the placement mechanism positions them on the support base, allowing the system to serve itself and eliminate manual labor while maintaining consistent testing conditions

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

Manual mechanical handling by operators is replaced with an automated mechanical system comprising the pick-up mechanism, conveying mechanism, and placement mechanism. This substitution eliminates the limitations of manual operation while maintaining the mechanical pickup and placement functions, thereby improving productivity without sacrificing operational simplicity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If manual handling of chips is used for strength measurement, then the device complexity is low, but the measurement accuracy decreases due to variability

Engineering Contradiction:

Improvesimplicity of device structureVSAvoidstrength measurement accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The apparatus performs automatic chip handling and positioning without human intervention, eliminating variability introduced by manual operations. The system self-regulates the pickup, conveyance, and placement processes, ensuring consistent testing conditions that improve measurement accuracy while adding only moderate device complexity

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

Manual mechanical handling is replaced with an automated mechanical system that provides precise and repeatable chip positioning. The automated system eliminates the variability inherent in manual operations, thereby improving measurement accuracy while maintaining a relatively simple device structure through the use of standardized mechanical components

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If manual chip pickup and placement is performed repeatedly, then the operational flexibility is high, but the time required for testing increases

Engineering Contradiction:

Improveoperational flexibilityVSAvoidtesting time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The automated testing apparatus performs chip pickup, conveyance, and placement operations continuously without interruption or repeated manual intervention. The system maintains continuous operation throughout the testing process, eliminating the time losses associated with manual repositioning and setup, thereby reducing total testing time while preserving operational flexibility through programmable control

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS11474143B2Testing apparatus

Publication Date: 2022.10.18 DISCO CORP

AI summary

A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.