Chip Stress Control Pattern for IC Warpage Compensation

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Solution Overview

Problem

The warpage of integrated circuit chips during manufacturing leads to quality deterioration in semiconductor elements, particularly in high-integration electronic devices.

Innovation Solution

A method involving the formation of a stress control pattern on chip substrates to compensate for warpage, followed by deformation based on warpage information, laminating chips with adhesive layers, and removing scribe lane areas to minimize warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If integrated circuit chips are manufactured with high integration, then electronic devices become smaller and lighter, but warpage occurs causing quality deterioration

Engineering Contradiction:

Improvesize of electronic deviceVSAvoidwarpage of integrated circuit chip

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The stress control pattern is formed on the chip substrate before the chip is fully processed and mounted. This preliminary formation of the stress control structure allows warpage compensation to be performed early in the manufacturing process, preventing warpage from developing during subsequent processing and assembly steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The stress control pattern is formed in specific regions of the chip substrate (in the scribe lane area) rather than uniformly across the entire chip. This localized approach allows precise control of stress in critical areas while maintaining the overall chip structure and functionality.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If warpage compensation is performed by deforming stress control pattern, then warpage is reduced, but additional manufacturing steps are required

Engineering Contradiction:

Improvewarpage of integrated circuit chipVSAvoidmanufacturing process steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The deformation of the stress control pattern is combined with the existing chip processing steps. The stress control pattern is formed and deformed using the same manufacturing equipment and processes already employed for chip fabrication, integrating the warpage compensation function into the existing manufacturing flow without requiring completely separate process equipment.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces warpage, minimizing defects such as interfacial peeling and misalignment, enhancing the quality and reliability of semiconductor elements.

Implementation Method 1

thermally compressing and curing the non-conductive adhesive films

Methodology Applied

Scientific EffectThermal compression: Compression

Data Source

PatentUS20260018535A1Method of manufacturing semiconductor element

Publication Date: 2026.01.15 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacturing a semiconductor element includes preparing integrated circuit chips, obtaining warpage information of each of the integrated circuit chips, deforming at least a portion of a chip stress control pattern of each of the integrated circuit chips according to the warpage information of each of the integrated circuit chips, laminating the integrated circuit chips on a carrier substrate with adhesive layers interposed therebetween, curing the adhesive layers, and removing chip scribe lane areas from the integrated circuit chips.