Chip-on-Submount Structure With Distortion Suppression Layer
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Solution Overview
Problem
The challenge in manufacturing a semiconductor laser chip is to reduce size without causing output power reduction and to prevent distortions that can occur in the chip, which can lead to the destabilization of the radial shape of laser light emitted from the semiconductor laser.
Innovation Solution
A chip-on-submount structure is designed with a broad area type chip that includes an active layer and a current injection stripe, a distortion suppression layer made of metal, a submount with a substrate and electrode layer, and a solder layer interposed between the distortion suppression layer and the electrode layer, where the distortion suppression layer includes a reaction layer and an unreacted layer with a thickness of not less than 1.4 µm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the width of the chip is decreased to reduce chip size and manufacturing cost, then chip size is reduced, but the degree of difficulty in manufacturing chip-on-submount structure increases and distortion occurs in the chip
Solution Approach 1:
A distortion suppression layer is introduced as an intermediary component between the chip and submount. This layer, made of metal with appropriate thickness, acts as a mediator that absorbs and distributes mechanical stress during the chip-on-submount manufacturing process, thereby reducing manufacturing difficulty and preventing chip distortion even when chip width is reduced.
Solution Approach 2:
The distortion suppression layer is constructed as a composite structure with multiple layers having different material properties. This composite design allows the structure to simultaneously provide mechanical support, stress distribution, and thermal management functions, enabling reduced chip size while maintaining manufacturability.
2Volume of moving object
If the width of the chip is decreased to reduce chip size, then chip size is reduced, but distortion occurs in the chip leading to destabilization of laser light radial shape
Solution Approach 1:
The distortion suppression layer serves as a protective intermediary that isolates the chip from mechanical stresses during mounting and operation. This layer prevents distortion of the chip structure, thereby maintaining the stability of the laser light radial shape even when chip dimensions are reduced.
Solution Approach 2:
The distortion suppression layer is designed with sufficient thickness beforehand to cushion and absorb mechanical stresses that would otherwise cause chip distortion. This pre-engineered cushioning capability ensures that the chip maintains its structural integrity and laser beam quality under various operating conditions.
3Power
If the current injection stripe width is increased to achieve high output power, then output power exceeds 10 W, but chip size increases
Solution Approach 1:
The invention optimizes the parameters of the distortion suppression layer, including its thickness and material composition, to enable the use of wider current injection stripes for high power output while maintaining compact chip dimensions. The layer's mechanical properties are specifically tuned to support high-power current injection without causing chip distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively suppresses distortions in the semiconductor laser chip, ensuring stable emission of laser light, thereby enhancing the stability of the radial shape of laser light emitted.
Implementation Method 1
a configuration is employed in which the distortion suppression layer includes a reaction layer, in which a component of the solder layer is diffused, and an unreacted layer, in which the component of the solder layer is not diffused
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
Provided is a chip-on-submount structure that is capable of suppressing distortions which can occur in a chip of a semiconductor laser. A chip-on-submount structure (1) includes: a chip (10) that includes a current injection stripe (161) which injects a current into an active layer (13); a distortion suppression layer (20) that covers the current injection stripe (161) and that is made of a metal; a submount (40) that includes an electrode layer (electrode pattern 42); and a solder layer (30) that is interposed between the distortion suppression layer (20) and the electrode layer (electrode pattern 42). In the distortion suppression layer (20), an unreacted layer (201) in which a component of the solder layer (30) is not diffused has a thickness of not less than 1.4 µm.