Chip-to-Substrate Adhesive Filling for Tight-Gap Bonding
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Solution Overview
Problem
Existing methods for manufacturing electronic devices face challenges in enhancing the robustness between electronic units and substrates, particularly due to poor caulking properties of adhesive materials when the space between the units and the substrate is small, which affects the overall quality and yield of the devices.
Innovation Solution
A method involving the application of an adhesive material with high optical transmittance and suitable viscosity between the chip and the substrate, using techniques like inkjet printing, to improve the caulking property and robustness, which includes filling the spaces and gaps between the units and the substrate, and optionally covering the top surfaces of the units, followed by curing to reinforce the bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is applied in the space between chip and substrate, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
An adhesive material is introduced as an intermediary substance between the chip and substrate to enhance bonding strength. The adhesive fills the space between these components, creating a stronger mechanical and chemical bond that overcomes the weakness of direct contact bonding.
Solution Approach 2:
The viscosity of the adhesive material is carefully controlled and adjusted to optimize its flow properties. By changing the viscosity parameter, the adhesive can properly fill the space between chip and substrate during application, then maintain its position without excessive spreading, thereby improving bonding while managing manufacturing complexity.
2Reliability
If adhesive material with suitable viscosity is used, then caulking property is improved, but material selection complexity increases
Solution Approach 1:
The viscosity of the adhesive material is precisely controlled within a specific range to optimize caulking properties. This parameter adjustment ensures the adhesive flows adequately to fill gaps and bond surfaces effectively, while preventing excessive spread that would compromise bonding precision.
Solution Approach 2:
The adhesive material functions as a composite solution combining proper viscosity characteristics with bonding functionality. By selecting materials with optimized viscosity ranges, the system achieves reliable caulking and bonding performance without requiring overly complex material formulations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding strength between electronic units and substrates, even when the distance between them is minimal, thereby improving the quality and yield of electronic devices and facilitating technological innovation.
Implementation Method 1
an adhesive material is applied to the space between the chip and the substrate
Implementation Method 2
followed by curing to reinforce the bonding strength
Data Source
AI summary
A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.