Chip-Attached Substrate Bonding Without Bubbles or Positional Shift

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods face challenges in achieving precise and bubble-free bonding of chips to substrates, particularly due to the difficulty in transforming and positioning small, diced chips without mixing air bubbles or contaminants.

Innovation Solution

A manufacturing method involving temporary bonding of chips to a first substrate, followed by separation and re-bonding to a third substrate, utilizing laser processing to form modification layers for precise separation and planarization, and direct bonding without liquid adhesives to enhance positional accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If diced chips are bonded one by one to a base wafer, then the chip-attached substrate can be manufactured, but poor bonding occurs between chips and substrate

Engineering Contradiction:

Improvebonding precisionVSAvoidbonding quality

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The process is segmented into three distinct stages: temporary bonding to first substrate, separation from first substrate, and final bonding to third substrate. This segmentation allows optimization of each stage independently, ensuring high bonding quality without the problems of direct one-by-one bonding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Chips are temporarily bonded to the first substrate in advance as a preliminary action. This temporary bonding allows chips to be positioned and held securely before the final bonding process, ensuring proper alignment and preventing poor bonding issues during the actual chip-substrate attachment.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If small diced chips are transformed and positioned, then chips can be bonded to substrate, but air bubbles and contaminants mix into the bonding interface

Engineering Contradiction:

Improvepositional accuracyVSAvoidcontamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The first substrate serves as an intermediary carrier for temporary bonding. This intermediary allows chips to be positioned and held without direct manipulation that would introduce air bubbles or contaminants. The separation process further eliminates contamination by removing the first substrate after temporary bonding.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The first substrate is extracted and removed after serving its temporary bonding purpose. This extraction eliminates the source of potential contamination while preserving the properly positioned chips for final bonding to the third substrate, ensuring a clean bonding interface.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If liquid adhesives are used for bonding, then chips can be attached to substrates, but positional deviation occurs

Engineering Contradiction:

Improvebonding processabilityVSAvoidpositional accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces liquid adhesive bonding with direct mechanical bonding through surface contact and pressure. This substitution eliminates the positional deviation caused by liquid adhesive flow and settling, while maintaining ease of manufacture through straightforward pressing and bonding processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures high precision and bubble-free bonding of chips to substrates, reducing the risk of positional deviation and contamination, thereby improving the quality of the chip-attached substrate.

Implementation Method 1

a modification layer is formed by a laser beam in a separation surface along which the stacked substrate is to be separated

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

the bonded surface of the first substrate and chip is transformed into a downwardly curved surface, and is gradually bonded starting from a center toward a periphery

Methodology Applied

Scientific EffectSurface transformation:

Data Source

PatentUS12543522B2Manufacturing method of chip-attached substrate and substrate processing apparatus

Publication Date: 2026.02.03 TOKYO ELECTRON LTD

AI summary

A manufacturing method of a chip-attached substrate includes preparing a stacked substrate including multiple chips, a first substrate to which the multiple chips are temporarily bonded, and a second substrate bonded to the first substrate with the multiple chips therebetween; and separating the multiple chips bonded to the first substrate and the second substrate from the first substrate to bond the multiple chips to one surface of a third substrate including a device layer.