Semiconductor Chip Encapsulation Using Substrate Pocket and Cover
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Solution Overview
Problem
Conventional semiconductor devices face challenges with reliability and manufacturing issues due to differences in coefficients of expansion between chips and substrates, leading to warpage behavior and requiring complex potting or pressing processes, which are inflexible and dependent on chip height.
Innovation Solution
A semiconductor device where the chip is completely encapsulated with a single material, using a substrate and cover with preconfigured pockets to fix the chip laterally and secure it, allowing for adaptable packaging height and flexibility in design, and enabling prefabrication of constituent parts for standardized production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional potting or pressing processes are used to mount chips on substrates, then the chips can be fixed and electrically connected, but the process becomes inflexible and dependent on chip height, causing manufacturing complexity and reliability issues due to different coefficients of expansion
Solution Approach 1:
The encapsulation is divided into two separate prefabricated components: a substrate with a recess and a cover with a corresponding protrusion. The chip is mounted in the recess of the substrate, and the cover is attached to complete the encapsulation. This segmentation allows each component to be manufactured independently with standardized dimensions, eliminating the need for height-dependent pressing or potting processes and enabling universal applicability across different chip designs.
2Reliability
If conventional encapsulation methods are used, then chips can be protected, but the package height becomes dependent on chip height, reducing flexibility in device design
Solution Approach 1:
The substrate is prefabricated with a recess and the cover is prefabricated with a corresponding protrusion before the chip is mounted. This preliminary configuration of the encapsulation components allows the package height to be determined by the standardized dimensions of the substrate and cover rather than by the variable height of the chip, providing flexibility in device design while ensuring reliable chip protection.
3Adaptability or versatility
If chips with different coefficients of expansion are mounted on substrates, then functional integration is achieved, but warpage behavior occurs due to thermal expansion differences
Solution Approach 1:
The encapsulation design changes the physical parameters of the package structure by using a recess in the substrate and a corresponding protrusion in the cover. This structural configuration provides mechanical support and constraint that compensates for the differential thermal expansion between chips and substrates, reducing warpage behavior while maintaining the ability to integrate different chip types with varying expansion coefficients.
Data Source
AI summary
A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.