Chip Support Board Block Layer Paddle Depth Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chip support board structures face challenges in maintaining the shape and depth of paddles during mass production, leading to surface irregularities and increased peeling issues due to the same material etching process, which affects the placement of carbon fiber prepreg cloth and conductive layers, resulting in reduced yield rates.
Innovation Solution
Incorporating a block layer on the metal substrate to maintain the shape and depth of the paddle, with an insulation layer and conductive layers forming a co-plane surface with the paddle, and using a solder resist to prevent short circuits, while the block layer is strategically positioned between the metal substrate and the paddle to enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the paddle is directly formed from the circuit layer through etching process, then the manufacturing process is simplified, but the shape and depth consistency of the paddle cannot be maintained in mass production
Solution Approach 1:
The invention divides the paddle structure into two separate components: the circuit layer and the paddle layer. The paddle is formed by etching through the circuit layer to expose the underlying metal substrate, creating a distinct separation between the circuit pattern and the conductive paddle element. This segmentation allows independent optimization of each layer's manufacturing precision.
Solution Approach 2:
The invention performs preliminary etching of the circuit layer to create a window opening that exposes the metal substrate before forming the paddle. This preliminary action establishes precise depth control and shape definition early in the manufacturing process, ensuring consistency in mass production while maintaining process simplicity.
2Ease of operation
If the paddle surface is exposed from the insulation layer to form a co-plane surface, then the circuit layer can be properly connected, but the board becomes easily peeled off due to external force
Solution Approach 1:
The invention applies different material properties to different regions: the insulation layer provides electrical isolation and mechanical support in most areas, while the exposed paddle surface on the metal substrate provides enhanced mechanical strength and peeling resistance at critical connection points. This local differentiation resolves the contradiction between connection ease and peeling resistance.
Solution Approach 2:
The invention creates a composite structure where the circuit layer (organic material), insulation layer (resin material), and metal substrate (metal material) are combined. The metal paddle exposed from the insulation layer provides superior mechanical strength and adhesion, preventing board peeling while maintaining proper circuit layer connection through the co-plane surface configuration.
3Adaptability or versatility
If the paddle depth and shape vary in mass production, then the manufacturing process is more flexible, but the location of carbon fiber prepreg cloth and conductive layer cannot be maintained constant
Solution Approach 1:
The invention establishes a preliminary etching pattern and window opening configuration that defines precise locations for carbon fiber prepreg cloth and conductive layer placement. This preliminary structure serves as a consistent reference framework that maintains component location consistency even when paddle depth or shape varies, allowing manufacturing flexibility without sacrificing precision.
Solution Approach 2:
The circuit layer acts as an intermediary element that bridges the variable paddle structure and the fixed-position carbon fiber prepreg cloth and conductive layer. By maintaining a consistent circuit layer configuration and etching pattern, the invention decouples the variability of paddle dimensions from the positioning requirements of other components, enabling both flexibility and precision.
Data Source
AI summary
A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.