Chip Electronic Component Surface Roughness for Static-Free Mounting

Solution Overview

Problem

Chip electronic components are prone to electrostatic charging during transportation and mounting due to exposure of the second main surface, leading to mounting defects and orientation issues when housed in a carrier tape.

Innovation Solution

The chip electronic component design features a second main surface with a surface roughness greater than the first main surface and side surfaces, reducing static electricity generation and ensuring proper orientation during mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the second main surface is exposed from the external electrode, then the chip electronic component can be easily handled and mounted, but the chip electronic component becomes prone to electrostatic charging when housed in a carrier tape

Engineering Contradiction:

Improvehandling and mounting easeVSAvoidelectrostatic charging

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a specific surface roughness condition only on the second main surface of the chip electronic component. The second main surface is designed to have a surface roughness of 0.1 μm or more, which is larger than the surface roughness of the first main surface and side surfaces. This localized surface characteristic reduces electrostatic charging when the second main surface contacts the cover tape during transportation, while maintaining the exposed configuration that facilitates easy handling and mounting.

Inventive Principle:

Principle #3Local quality

2Reliability

If the second main surface contacts the cover tape during transportation, then the component is protected during shipping, but static electricity is generated causing mounting defects

Engineering Contradiction:

Improveprotection during shippingVSAvoidstatic electricity generation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by modifying the surface roughness parameter of the second main surface. By setting the surface roughness to 0.1 μm or more (larger than the first main surface and side surfaces), the contact characteristics between the chip and cover tape are changed. This parameter modification reduces the generation of static electricity during contact, thereby preventing electrostatic charging while maintaining the protective function of the cover tape during shipping.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If the cover tape is peeled from the carrier tape, then the chip electronic component can be accessed for mounting, but the electrostatically charged component adheres to the cover tape and cannot be mounted

Engineering Contradiction:

Improvemounting accessibilityVSAvoidmounting success rate

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by creating a specific surface roughness condition only on the second main surface of the chip electronic component. The second main surface is designed to have a surface roughness of 0.1 μm or more, which is larger than the surface roughness of the first main surface and side surfaces. This localized surface characteristic reduces electrostatic charging when the second main surface contacts the cover tape during transportation, while maintaining the exposed configuration that facilitates easy handling and mounting.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies parameter changes by modifying the surface roughness parameter of the second main surface. By setting the surface roughness to 0.1 μm or more (larger than the first main surface and side surfaces), the contact characteristics between the chip and cover tape are changed. This parameter modification reduces the generation of static electricity during contact, thereby preventing electrostatic charging while maintaining the protective function of the cover tape during shipping.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents electrostatic charging and ensures reliable mounting by minimizing static electricity, thereby reducing defects and ensuring accurate placement on electronic devices.

Implementation Method 1

The second main surface tends to come into contact with the cover tape. For example, when transporting the chip electronic component, the chip electronic component may move within the cavity in a state where the second main surface is in contact with the cover tape. In this case, static electricity tends to be generated, and the chip electronic component (element body) may become electrostatically charged.

Methodology Applied

Scientific EffectElectrostatic charging: Electrostatics

Data Source

PatentUS20260066172A1Chip electronic component and electronic component package

Publication Date: 2026.03.05 TDK CORP

AI summary

A chip electronic component includes an element body and an external electrode. The element body includes a first main surface arranged to constitute a mounting surface, a second main surface opposing the first main surface, and a side surface adjacent to the first main surface and the second main surface. The external electrode includes an electrode portion that is disposed on the first main surface. The second main surface is exposed from the external electrode, and has a surface roughness larger than a surface roughness of the first main surface and larger than a surface roughness of the side surface.