Chip Test Fixture With Feedback Temperature Control
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Solution Overview
Problem
Existing chip testing devices fail to accurately control the temperature of power semiconductor chips during the power-on performance test, leading to poor temperature stability and affecting the accuracy of the test results.
Innovation Solution
A chip testing device with a heat sink base equipped with a first temperature sensor to measure the actual temperature of the chip, combined with a heating component and thermal isolation base to ensure precise temperature control, and a package testing machine with a die loading apparatus and high-speed linear motor for efficient and accurate testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating function is added to the chip testing device, then the chip can be heated to complete power-on performance tests, but the actual temperature of the chip cannot be accurately controlled, resulting in poor temperature stability
Solution Approach 1:
The patent implements a feedback control system by placing a temperature sensor in thermal contact with the chip through the heat sink base. The sensor continuously monitors the chip's actual temperature and feeds this information back to a control system, which adjusts the heating power accordingly. This closed-loop feedback mechanism enables precise temperature control and maintains temperature stability during power-on performance tests.
Solution Approach 2:
The patent introduces a heat sink base as an intermediary component between the heating element and the chip. The heat sink base serves as a thermal mediator that not only transfers heat to the chip but also provides a mounting position for the temperature sensor, enabling indirect thermal contact and accurate temperature measurement without direct sensor-to-chip contact.
2Strength
If the upper base is pressed against the lower base to secure the chip, then the chip is firmly held for testing, but the contact pressure may affect heat transfer uniformity
Solution Approach 1:
The patent applies local quality by designing the pressure transmission structure to distribute contact pressure uniformly across the chip-substrate interface. The upper base and lower base are configured with corresponding pressure distribution features that ensure even pressure application, preventing localized hot spots or cold spots that would compromise heat transfer uniformity while maintaining secure chip holding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides precise temperature monitoring and control, ensuring high accuracy and stability in chip testing, supporting multi-station parallel testing and preventing fire hazards, while meeting high-voltage and high-temperature testing requirements.
Implementation Method 1
a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip
Implementation Method 2
a first temperature sensor in the heat sink base to measure an actual temperature of the test chip
Data Source
AI summary
Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting part beneath the first mounting part; a first test probe, penetrating the upper base and contacts the test chip to obtain an electrical signal of the test chip; a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip; and a first temperature sensor in the heat sink base to measure an actual temperature of the test chip.