Fastening-Based Chip Test Head Alignment and Force Control

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Solution Overview

Problem

Existing chip testing methods face issues of machine instability, material fatigue, and potential damage due to strong depressing forces, and inaccuracies from improper attachment of the depressing head to the chip, leading to testing inaccuracy and risk of chip or spring probe damage.

Innovation Solution

An electronic element testing device with a fastening-based depressing mechanism, comprising a carrier platform, support frame, depressing mechanism, displacement adjustment module, and test socket, which includes a lifting module, depressing head, fastening module, and control module to precisely attach and apply a controlled depressing force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a strong depressing force is applied to ensure full contact between chip and spring probes, then contact reliability is improved, but machine stability deteriorates and material fatigue increases

Engineering Contradiction:

Improvecontact reliabilityVSAvoidmachine stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent employs a dynamic depressing mechanism where the depressing head can move vertically to adapt to chip thickness variations. The mechanism includes a depressing force generation apparatus that applies force dynamically rather than statically, allowing the system to maintain contact reliability while avoiding excessive force that would cause machine instability or material fatigue

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the parameter of depressing force from a fixed strong force to a controllable variable force. The depressing force generation apparatus can adjust the magnitude of force applied based on real-time feedback or pre-set parameters, ensuring sufficient contact without exceeding thresholds that would damage components or destabilize the machine

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a strong depressing force is applied to ensure full contact between chip and spring probes, then contact reliability is improved, but material fatigue increases

Engineering Contradiction:

Improvecontact reliabilityVSAvoidmaterial fatigue

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The depressing mechanism uses dynamic force application rather than continuous static force. The lifting module and depressing force generation apparatus work together to apply force only when needed for contact, reducing cumulative stress on materials and extending component lifespan while maintaining contact reliability during testing operations

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system employs periodic or intermittent depressing action rather than continuous force application. The lifting module can raise and lower the depressing head as needed, applying force only during contact phases, which reduces material fatigue from constant loading while ensuring reliable contact when testing occurs

Inventive Principle:

Principle #19Periodic action

3Ease of operation

If the depressing head is not precisely attached to the chip, then attachment ease is improved, but testing precision deteriorates and damage risk increases

Engineering Contradiction:

Improveattachment easeVSAvoidtesting precision

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent introduces an intermediary mechanism between the depressing head and chip - a lifting module with fastening capability. This intermediary allows for precise positioning and secure attachment of the depressing head to the chip, ensuring testing precision while maintaining ease of operation through automated or assisted attachment processes rather than requiring manual precision alignment

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system replaces manual mechanical alignment and attachment with an automated lifting and fastening mechanism. The lifting module can precisely position the depressing head over the chip and secure it automatically, eliminating the need for operator skill in precise attachment while ensuring consistent, damage-free contact for accurate testing

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20260050007A1Electronic element testing device with fastening-based depressing mechanism and method thereof

Publication Date: 2026.02.19 CHROMA ATE INC

AI summary

An electronic element testing device with a fastening-based depressing mechanism includes a carrier platform, a support frame, a depressing mechanism, a displacement adjustment module, and a test socket. The support frame is arranged on the carrier platform. The depressing mechanism is connected to the support frame. The depressing mechanism includes a lifting module, a depressing head, and a fastening module. The depressing head is connected to the lifting module. The lifting module is configured to drive the depressing head to move toward or away from the carrier platform. The fastening module is configured to fasten the lifting module. The displacement adjustment module is arranged above the carrier platform. The test socket includes a slot for accommodating an electronic element. The test socket is connected to the displacement adjustment module. The displacement adjustment module is configured to adjust displacement of the test socket in at least one axial direction.