Chip Testing Method Preventing Contact Damage
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Solution Overview
Problem
Conventional memory chip testing apparatuses cause damage to memory chip contacts due to repeated detachment and mounting during high temperature, low temperature, and burn-in tests.
Innovation Solution
A chip testing method that uses a system with a chip mounting apparatus, chip testing devices, environment control apparatuses, and a classification apparatus, where chips are mounted once and tested within temperature-controlled chambers without being detached, using a power supply to perform testing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional memory chip testing apparatus repeatedly detach and mount the memory chip for high temperature, low temperature, and burn-in tests, then the testing process can be completed, but the contacts of the memory chip are easily damaged
Solution Approach 1:
The testing system is divided into separate functional modules: a temperature control chamber for environmental testing, a testing device with electrical connection sockets for electrical testing, and a classification apparatus for result sorting. This segmentation allows the memory chip to remain mounted on the testing device while being subjected to different testing conditions, eliminating repeated detachment and mounting operations that cause contact damage.
Solution Approach 2:
The testing device serves as an intermediary carrier that holds the memory chip throughout the entire testing process. The chip is mounted on the testing device's electrical connection sockets, and the testing device is then transferred to the temperature control chamber for environmental testing. This intermediary approach allows the chip to remain securely mounted while exposed to different testing environments, preventing contact damage from repeated handling.
2Adaptability or versatility
If the memory chip is repeatedly detached and mounted during testing, then different test conditions can be applied, but the testing time is increased and efficiency is reduced
Solution Approach 1:
The memory chip remains continuously mounted on the testing device throughout the entire testing process, including during high temperature, low temperature, and burn-in tests. The testing device is transferred as a complete unit to different temperature control chambers or remains in place while environmental conditions are changed. This continuous mounting eliminates repeated detachment and mounting operations, significantly reducing testing cycle time while maintaining the ability to apply different test conditions.
Solution Approach 2:
The testing device is designed with universal electrical connection sockets that can interface with different temperature control chambers and testing configurations. This multi-functionality allows the same testing device with the mounted chip to be used for various types of tests (electrical testing, high temperature testing, low temperature testing, burn-in testing) without requiring detachment and remounting, thereby reducing testing time while maintaining test condition flexibility.
3Ease of operation
If conventional testing apparatus uses separate mounting and testing locations, then the testing process can be simplified, but the chip contacts are damaged from repeated handling
Solution Approach 1:
The mounting function and testing function are merged into a single integrated process. The memory chip is mounted once on the testing device's electrical connection sockets, and the testing device serves as the carrier for all subsequent testing operations including electrical testing, environmental testing in temperature control chambers, and burn-in testing. This merging eliminates the need to repeatedly detach and remount the chip between different locations, maintaining contact integrity while keeping the testing process simple and streamlined.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to memory chip contacts by maintaining continuous mounting during testing, ensuring efficient and reliable testing without repeated detachment and mounting.
Implementation Method 1
controlling an operation of the temperature adjusting device in the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature
Implementation Method 2
at least one power supply member connected to the circuit board, wherein the at least one power supply member is configured to convert electricity provided from an external power supply apparatus to the testing modules
Data Source
AI summary
A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.