Chip Testing Device Segmentation for Temperature Adaptability
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Solution Overview
Problem
Conventional memory chip testing apparatuses face inefficiencies and damage due to repeated detachment and mounting of memory chips during high and low temperature tests, leading to time waste and contact damage.
Innovation Solution
A chip testing device with a circuit board, electrical connection sockets, and a control set that allows multiple chips to be tested without detachment, using a robotic arm to transfer the device between temperature environments, ensuring continuous electrical connection and reducing testing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If memory chips are repeatedly detached and mounted during high and low temperature tests, then testing can be performed in different temperature environments, but testing time increases and contact damage occurs
Solution Approach 1:
The testing system is segmented into a stationary chip testing device with temperature-controlled chambers and a movable carrier that holds multiple chips. This allows different temperature zones to be created without moving the chips themselves, resolving the contradiction between temperature adaptability and time loss.
Solution Approach 2:
A carrier board serves as an intermediary between the chips and the testing system. The carrier is transferred between temperature chambers while the chips remain mounted, eliminating repeated detachment and mounting operations while still enabling testing in different temperature environments.
2Adaptability or versatility
If memory chips are repeatedly detached and mounted during testing, then different tests can be performed, but contact damage occurs
Solution Approach 1:
The system separates the chip mounting function (performed once on the carrier) from the testing function (performed in different temperature chambers). This segmentation ensures that chip contacts are established once and not subjected to repeated mechanical stress from detachment and remounting, thereby preventing contact damage while maintaining testing versatility.
Solution Approach 2:
The carrier board acts as an intermediary that protects the chip contacts. Once chips are mounted on the carrier, the carrier itself is moved between testing environments, shielding the chip contacts from mechanical damage while still allowing different tests to be performed on the same chips.
3Productivity
If conventional testing apparatus is used, then chips can be tested, but repeated detachment and mounting reduces testing efficiency
Solution Approach 1:
The testing system is divided into specialized modules: a chip mounting station, multiple temperature-controlled testing chambers, and a carrier transfer mechanism. This segmentation allows each component to be optimized for its specific function, improving overall testing efficiency while distributing the complexity across manageable, independent units rather than requiring a single complex apparatus.
Solution Approach 2:
The carrier board serves as an intermediary that simplifies the overall process. By mounting multiple chips on a single carrier and transferring the entire carrier between testing environments, the system reduces the complexity of individual chip handling while improving productivity through batch processing and eliminated repeated mounting operations.
Data Source
AI summary
A chip testing device for being transferred among a plurality of working stations includes a circuit board, a control set, and a plurality of connection terminals. The circuit board is provided with a plurality of electrical connection sockets disposed thereon each for carrying a chip. The control set includes a plurality of testing modules disposed on the circuit board. The connection terminals are disposed on the circuit board. When the connection terminals are connected to an external power supply device, the testing modules are connected to the electrical connection sockets, and each of the testing modules is able to test the chip on the electrical connection socket connected thereto.