Chip Testing Apparatus with Local Fluid Temperature Control
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Solution Overview
Problem
Conventional chip testing apparatuses face reliability issues due to temperature inconsistencies within ovens or freezers, leading to unreliable testing results as chips are not uniformly tested at predetermined high or low temperatures.
Innovation Solution
A chip testing apparatus featuring a temperature adjusting device with fluid channels and pressing components that allow each chip to independently exchange heat with a fluid at a predetermined temperature, ensuring consistent testing conditions through the use of an air suction apparatus and a lid to maintain a negative pressure environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If chips are tested in an oven using a hot air blower, then high temperature testing is achieved, but temperature uniformity deteriorates causing unreliable testing results
Solution Approach 1:
The patent divides the testing system into multiple independent temperature control zones, with separate heating elements and temperature sensors for different chip testing sockets. This segmentation allows each chip to be tested under its own controlled temperature conditions, preventing the temperature uniformity issues that occur when using a single hot air blower for the entire oven.
Solution Approach 2:
The patent implements local temperature control by providing individual heating elements and temperature sensors for each chip testing socket. This allows precise control of temperature at each local position, ensuring that each chip experiences the predetermined temperature uniformly, rather than relying on global oven heating that creates temperature gradients.
2Temperature
If chips are tested in a freezer or cold room, then low temperature testing is achieved, but temperature uniformity deteriorates causing unreliable testing results
Solution Approach 1:
The patent divides the testing system into multiple independent temperature control zones, with separate cooling elements and temperature sensors for different chip testing sockets. This segmentation allows each chip to be tested under its own controlled temperature conditions, preventing the temperature uniformity issues that occur when using a single freezer or cold room environment.
Solution Approach 2:
The patent implements local temperature control by providing individual cooling elements and temperature sensors for each chip testing socket. This allows precise control of temperature at each local position, ensuring that each chip experiences the predetermined low temperature uniformly, rather than relying on global freezer or cold room cooling that creates temperature variations.
3Productivity
If a single oven or freezer is used for multiple chips, then testing capacity is improved, but temperature control precision deteriorates
Solution Approach 1:
The patent divides the testing system into multiple independent temperature control zones, with each zone having its own heating/cooling elements and temperature sensors. This allows multiple chips to be tested simultaneously in the same apparatus while maintaining precise temperature control for each chip, as each zone operates independently rather than relying on a single oven or freezer.
Solution Approach 2:
The patent implements local temperature control by providing individual temperature control elements for each chip testing socket. This ensures that even when multiple chips are tested simultaneously, each chip experiences precise temperature control at its local position, eliminating the temperature variations that would occur in a shared oven or freezer environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures that each chip is tested at a precise predetermined temperature, enhancing the accuracy and reliability of the testing results by maintaining uniform temperature conditions across all chips.
Implementation Method 1
the fluid flowing through each of the pressing components is configured to exchange heat with the adjacent one of the chips under test
Implementation Method 2
When the air suction apparatus suctions away air among the lid, the at least one temperature adjusting device, and the at least one substrate
Data Source
AI summary
A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.