Chip Testing Socket Segmentation for Temperature Cycling

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Solution Overview

Problem

Conventional memory chip testing apparatuses face inefficiencies and damage due to repeated detachment and mounting of memory chips during high and low temperature tests, leading to prolonged testing times and contact damage.

Innovation Solution

A chip testing device and system that includes a circuit board, fixing assembly, electrical connection sockets, control set, and power supply, allowing chips to be transferred between temperature environments without detachment, using a robotic arm and environment control apparatus to maintain consistent testing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If memory chips are repeatedly detached and mounted for high and low temperature testing, then testing coverage is improved, but testing time increases and chip contacts are damaged

Engineering Contradiction:

Improvetesting coverageVSAvoidtesting time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The testing system is divided into separate functional modules: a chip mounting device with sockets that can remain stationary, and temperature testing modules that can be independently applied. This segmentation allows the chip to stay mounted while different temperature testing functions are applied sequentially, eliminating the need for repeated physical detachment and mounting.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system dynamically switches between different testing modes (high temperature testing and low temperature testing) without physically moving the chip. The temperature conditions are dynamically adjusted while the chip remains mounted on the socket, allowing flexible testing coverage without repeated mechanical operations.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If memory chips are repeatedly detached and mounted for temperature testing, then testing coverage is improved, but chip contact damage increases

Engineering Contradiction:

Improvetesting coverageVSAvoidchip contact integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

By separating the chip mounting function from the temperature testing function, the chip contacts remain permanently engaged with the socket while temperature testing is applied through environmental control. This eliminates mechanical stress on contacts during temperature changes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The socket structure is designed with protective features that cushion and protect the chip contacts from thermal expansion and contraction stresses before damage can occur. The rigid socket structure compensates for dimensional changes during temperature cycling.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Adaptability or versatility

If conventional testing apparatuses are used for high and low temperature testing, then testing functionality is achieved, but testing efficiency is low

Engineering Contradiction:

Improvetemperature testing capabilityVSAvoidtesting efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The chip mounting device and temperature testing capabilities are merged into a single integrated system. The chip remains mounted on the socket while the system can simultaneously provide high temperature and low temperature testing environments, eliminating time losses from repeated mounting and demounting operations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The chip remains continuously mounted on the socket throughout the entire testing process, eliminating idle time between temperature testing operations. The useful action of testing continues without interruption as the temperature environment is simply changed rather than physically reconfiguring the chip mounting.

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS11366155B2Chip testing device and chip testing system for testing memory chips

Publication Date: 2022.06.21 ONE TEST SYST

AI summary

A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.