Chip Testing System Temperature Control

The patent combines multiple testing functions (high temperature testing, low temperature testing, and burn-in testing) into a single integrated testing device. The device includes multiple electrical connection sockets that can simultaneously accommodate multiple memory chips, and incorporates both heating and cooling devices within the same device structure. This allows memory chips to undergo comprehensive temperature testing without being transferred between different devices, thereby preventing contact damage while maintaining testing versatility.

The patent enables continuous testing operations by allowing memory chips to remain mounted on the same testing device throughout the entire testing process. The device can simultaneously conduct high temperature tests, low temperature tests, and burn-in tests on different chips or different phases of the same chip without requiring detachment or remounting. This continuous operation eliminates the time loss associated with repeated handling and significantly improves testing throughput.

The patent divides the testing device into distinct functional modules: multiple electrical connection sockets for mounting chips, a heating device for high temperature testing, a cooling device for low temperature testing, and a control unit for coordinating operations. Each module performs a specific function, and they work together in an integrated system. This modular segmentation allows the device to perform multiple testing functions simultaneously while maintaining a manageable and organized structure.