Power Semiconductor Chip Testing with Bendable Wire Probes
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Solution Overview
Problem
Existing methods for testing power semiconductor chips risk damaging the chips due to physical contact when forming a path for large currents, which can lead to safety issues and increased disposal costs.
Innovation Solution
An apparatus and method using a chuck with direct and indirect connection portions, where wire probes are bendable and a leaf spring is used to form a current path without direct contact, allowing for large current testing while minimizing chip damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical contact is used to form a path for large current flow in the power semiconductor chip, then the testing can be performed, but the power semiconductor chip may be damaged
Solution Approach 1:
The patent introduces a chuck as an intermediary component between the testing apparatus and the power semiconductor chip. The chuck includes contact portions that can be elastically deformed to contact the chip electrodes, serving as a mediator that transmits electrical current without requiring direct rigid contact between the testing apparatus and the chip, thereby preventing physical damage while enabling reliable electrical testing
Solution Approach 2:
The patent utilizes elastic deformation of the contact portions in the chuck as a key parameter change mechanism. The contact portions are designed to be elastically deformable, allowing them to adapt to the chip surface and form reliable electrical contact through parameter change (deformation) rather than rigid physical contact, thus enabling large current flow testing without damaging the chip
2Object-affected harmful factors
If wire probes are made bendable to reduce contact damage, then chip damage is minimized, but connection stability may be compromised
Solution Approach 1:
The patent applies elastic deformation as a parameter change mechanism to the wire probes and contact portions. These components are designed to be elastically deformable, allowing them to bend and adapt to the chip surface during connection while maintaining stable electrical contact. The elastic deformation enables the probes to accommodate surface irregularities and thermal expansion without compromising connection stability, thus preventing chip damage while ensuring reliable electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to power semiconductor chips during testing, improving safety and reducing failure costs by ensuring accurate and efficient electrical parameter measurement.
Implementation Method 1
The chuck may have a vacuum suction hole sucking the power semiconductor chip
Implementation Method 2
a direct connection portion including a plurality of wire probes directly contacting one surface of the power semiconductor chip
Implementation Method 3
an indirect connection portion forming an electrical connection path to the other surface of the power semiconductor chip through the chuck
Data Source
AI summary
An apparatus for testing a power semiconductor chip includes a chuck having a surface configured so that a power semiconductor chip is positioned on the surface of the chuck, a direct connection portion including a plurality of wire probes directly contacting one surface of the power semiconductor chip, and an indirect connection portion forming an electrical connection path to the other surface of the power semiconductor chip through the chuck, wherein each of the plurality of wire probes is configured to be bendable by pressure applied to both ends of each of the plurality of wire probes.