IC Chip Thermal Isolation Layout for Heat-Sensitive Components
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Solution Overview
Problem
Integrated circuit chip devices face challenges in managing heat transfer from heat-generating components to heat-sensitive components, which can lead to increased noise and reduced performance in photosensitive devices due to temperature variations.
Innovation Solution
The construction of an integrated circuit chip device includes a substrate with a cavity and vias to reduce thermal conductivity to heat-sensitive components, while using a heat sink with higher thermal conductivity to direct heat away from these components, thereby controlling thermal resistance and maintaining optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat-generating components are placed close to heat-sensitive components to reduce device size, then device integration increases, but thermal interference increases causing noise and performance degradation
Solution Approach 1:
The device is divided into distinct thermal zones: a first region containing heat-sensitive components and a second region containing heat-generating components. Thermal isolation structures (insulating material and air gaps) are introduced between these regions to segment the thermal pathways, allowing close physical proximity while maintaining thermal separation.
Solution Approach 2:
Thermal isolation structures consisting of insulating material and air gaps are introduced as intermediary elements between heat-generating and heat-sensitive components. These intermediaries block direct thermal conduction while allowing electrical and optical connections to pass through, resolving the conflict between proximity and thermal interference.
2Object-affected harmful factors
If thermal isolation structures are added between heat-generating and heat-sensitive components, then thermal interference is reduced, but device complexity increases
Solution Approach 1:
Air gaps are utilized as thermal isolation structures between components. The air gaps serve as porous/void spaces that provide effective thermal insulation while being simpler to implement than solid insulating materials, reducing the added complexity while maintaining thermal separation effectiveness.
Solution Approach 2:
The thermal isolation system employs a composite structure combining insulating material with air gaps. This composite approach optimizes thermal isolation performance while managing the complexity by using materials and structures that can be integrated into existing semiconductor fabrication processes.
3Temperature
If heat sink is used to cool heat-sensitive components, then operating temperature is maintained, but additional components and space are required
Solution Approach 1:
Heat-generating components are extracted and separated from heat-sensitive components into a distinct second region. This spatial extraction eliminates the need for active heat sinking on the heat-sensitive components, as the heat sources are physically removed from proximity, thereby maintaining temperature stability without adding cooling components.
Solution Approach 2:
The thermal isolation structures passively maintain operating temperatures of heat-sensitive components by blocking thermal conduction from heat-generating components. This passive thermal management approach eliminates the need for active cooling systems, allowing the device to self-regulate temperatures through structural design alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces noise in photosensitive devices by maintaining a stable temperature, allowing heat-sensitive components to operate optimally despite heat generated by other components, achieving temperatures as low as -30°C while the heat-generating components operate at 40°C.
Implementation Method 1
A via medium is positioned in the thermal via and has a higher thermal conductivity than the thermal insulator. The via medium is located under one of the optical components.
Implementation Method 2
The zone definer includes a thermal insulator having a lower thermal conductivity than both the heat sink and the base.
Implementation Method 3
a thermoelectric semiconductor formed under the CMOS image sensor for selectively cooling the image sensor
Data Source
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AI summary
An integrated circuit chip device configured provide thermal control by directing heat transfer away from a heat sensitive component. The structure directs the heat transfer away from the heat sensitive component so that the heat sensitive component can be maintained at reduced operating temperatures for improved performance.