Chip Mounting Head Tilt Correction for Parallel Substrate Bonding
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Solution Overview
Problem
Existing semiconductor manufacturing devices fail to maintain high parallelization of chips with respect to substrates, leading to potential electrical bonding defects due to misalignment.
Innovation Solution
A semiconductor manufacturing device equipped with a stage, installing head, measuring mechanism, and holding surface adjusting mechanism, which measures and corrects the tilt angle of the chip holding surface to ensure precise alignment with the substrate, utilizing a controller to calculate and apply correction amounts based on past detection tilt angles and substrate variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the chip is disposed on the substrate without tilt angle correction, then the manufacturing process is simple and fast, but the degree of parallelization between chip and substrate is low, causing electrical bonding defects
Solution Approach 1:
The patent applies preliminary action by measuring the tilt angle of the chip holding surface before chip mounting and pre-calculating the correction amount. The holding surface adjusting mechanism is positioned in advance to apply the calculated correction, ensuring the chip mounting surface is properly aligned before the actual bonding process occurs. This prevents bonding defects by addressing the tilt issue proactively rather than reactively.
Solution Approach 2:
The patent implements feedback by using a measuring mechanism to detect the actual tilt angle of the chip holding surface, comparing it against the ideal parallel alignment, and using this measurement information to calculate and apply the appropriate correction amount through the holding surface adjusting mechanism. This closed-loop feedback system ensures high degree of parallelization while maintaining manufacturing precision.
2Reliability
If the tilt angle of the chip holding surface is not corrected, then the manufacturing process is fast and efficient, but electrical bonding defects occur due to misalignment between bump electrode and substrate electrode
Solution Approach 1:
The system performs preliminary measurement of the holding surface tilt angle and pre-calculates the correction amount before the chip mounting process. This allows the actual bonding operation to proceed quickly with pre-established alignment, maintaining high productivity while ensuring bonding reliability through advance preparation.
Solution Approach 2:
The patent replaces complex mechanical alignment procedures with an automated measurement and calculation system. The measuring mechanism digitally captures the tilt angle, the controller calculates the precise correction amount through computational algorithms, and the holding surface adjusting mechanism applies the correction automatically. This substitution of mechanical trial-and-error alignment with measurement-based computational control maintains productivity while dramatically improving bonding reliability.
Data Source
AI summary
A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.