Radiation-Emitting Chip Transfer Using Self-Stabilizing Dielectric Layers

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Solution Overview

Problem

Existing methods for producing radiation-emitting semiconductor chips are inefficient and costly, lacking a cost-effective and reliable process for manufacturing these chips while maintaining high efficiency and flexibility in integration into various housings.

Innovation Solution

A method involving the use of a carrier arrangement that mechanically connects semiconductor bodies only through holding elements, allowing for non-destructive separation and efficient transfer of semiconductor chips, combined with transparent conductive materials and reflective metals to enhance light coupling and reduce absorption losses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional methods are used to produce radiation-emitting semiconductor chips, then manufacturing can be performed with existing processes, but production is inefficient and costly

Engineering Contradiction:

Improveproduction efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent divides the semiconductor wafer into multiple semiconductor bodies (individual chips) through a carrier arrangement that enables separate handling and processing of each chip. This segmentation allows parallel processing and reduces overall manufacturing time and cost while maintaining high production efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a carrier arrangement as an intermediary device that holds multiple semiconductor bodies during manufacturing processes. This carrier enables efficient transfer, positioning, and processing of multiple chips simultaneously, resolving the contradiction between production efficiency and manufacturing cost by providing a cost-effective platform for high-volume production.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If semiconductor bodies are mechanically connected through multiple contact points, then mechanical stability is improved, but flexibility in transfer and integration is reduced

Engineering Contradiction:

Improvemechanical stabilityVSAvoidflexibility in integration

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The mechanical connection is segmented into discrete holding elements rather than continuous contact. Each semiconductor body is held by specific holding elements that provide stable mechanical connection while leaving other areas free for flexible positioning and integration into different housings and applications.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The carrier arrangement implements local mechanical connection through holding elements at specific locations on the semiconductor bodies, while maintaining local freedom in other areas. This allows mechanical stability where needed (at contact points) while preserving flexibility in integration elsewhere, resolving the contradiction between strength and adaptability.

Inventive Principle:

Principle #3Local quality

3Reliability

If opaque contact layers are used, then electrical conductivity is improved, but light absorption losses increase

Engineering Contradiction:

Improveelectrical conductivityVSAvoidlight absorption losses

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The contact layers are designed with local quality variations: transparent conductive materials are used in regions where light emission is desired, while opaque conductive materials are used only in specific contact regions where electrical connection is needed but light emission is not required. This resolves the contradiction by optimizing both electrical conductivity and light transmission in their respective locations.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite material structures for contact layers, combining transparent conductive materials (such as ITO - indium tin oxide) with opaque conductive materials in specific configurations. This composite approach enables simultaneous achievement of electrical conductivity and minimal light absorption, resolving the contradiction between reliability and energy loss.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables the production of radiation-emitting semiconductor chips, such as micro-LEDs, with improved efficiency, reduced material absorption, and enhanced flexibility in integration, facilitating their use in diverse applications.

Implementation Method 1

reflective metals to enhance light coupling and reduce absorption losses

Methodology Applied

Scientific EffectReflection: Reflection

Implementation Method 2

reduce material absorption losses

Methodology Applied

Scientific EffectAbsorption: Absorption (EM radiation)

Data Source

PatentUS12519088B2Method for producing radiation-emitting semiconductor chips, radiation-emitting semiconductor chip and radiation-emitting component

Publication Date: 2026.01.06 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

In an embodiment a method for producing radiation-emitting semiconductor chips includes providing a semiconductor wafer, applying first contact layers on the semiconductor wafer, applying a second dielectric layer on the semiconductor wafer and the first contact layers, attaching a carrier arrangement to the semiconductor wafer, singulating the semiconductor wafer into semiconductor bodies and applying second contact layers on the semiconductor bodies, wherein the second dielectric layer is formed such that it mechanically stabilizes itself.