Chip Transfer Device With Movable Pick-Up Modules

Solution Overview

Problem

Conventional chip transfer processes for micro LEDs are inefficient and prone to errors due to the need for multiple iterations to adjust chip intervals on a printed circuit board, resulting in slow transfer speeds and potential misalignment.

Innovation Solution

A chip transfer device with movable pick-up modules and a controller that collectively picks up chips from wafers, adjusts their intervals, and mounts them on a printed circuit board, utilizing a grid pattern arrangement and toothed surfaces for precise alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional chip transfer process is used with multiple iterations to adjust chip intervals, then chip mounting can be completed, but transfer speed becomes too slow and error risk increases

Engineering Contradiction:

Improvechip transfer speedVSAvoidinterval accuracy

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The pick-up modules are pre-positioned at predetermined intervals on the support before the chip transfer process begins. This preliminary arrangement of the pick-up modules eliminates the need for multiple iterative adjustments during the transfer process, enabling direct one-step transfer of chips from the wafer to the printed circuit board at the correct intervals, thereby improving both transfer speed and interval accuracy

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention replaces the conventional mechanical iterative adjustment system with a controller-based positioning system. The controller automatically controls the pick-up modules to move to predetermined positions based on stored position information, substituting manual or mechanical trial-and-adjustment processes with automated digital control, thus eliminating errors and improving reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If multiple iterations are performed to adjust intervals between chips, then chip placement accuracy can be achieved, but transfer time increases significantly

Engineering Contradiction:

Improvechip interval precisionVSAvoidtransfer time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The pick-up modules are pre-positioned at predetermined intervals on the support before the chip transfer process begins. This preliminary arrangement of the pick-up modules eliminates the need for multiple iterative adjustments during the transfer process, enabling direct one-step transfer of chips from the wafer to the printed circuit board at the correct intervals, thereby improving both transfer speed and interval accuracy

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The controller stores position information of the pick-up modules and uses this feedback mechanism to automatically control their movement to predetermined positions. This closed-loop control ensures that chips are transferred at precise intervals without requiring manual measurement or iterative adjustment, achieving high manufacturing precision while minimizing transfer time

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS11004705B2Chip transfer device and chip transferring method using the same

Publication Date: 2021.05.11 SAMSUNG ELECTRONICS CO LTD

AI summary

A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.