Semiconductor Chip Transfer Using Segmented Bonding Protrusions
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Solution Overview
Problem
The manufacturing process of light emitting diode displays faces inefficiencies and increased costs due to foreign substances adhering to bonding agents during the transfer of micro light emitting elements, leading to higher defect rates and consumption of bonding agents.
Innovation Solution
A display device manufacturing method involving a substrate with semiconductor chips, where a first semiconductor chip is bonded to a transfer member with a transfer layer and bonding layer, and separated using laser light, allowing precise transfer and reduced material consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a donor is repeatedly used for transferring micro light emitting elements, then productivity is maintained, but foreign substances adhere to the bonding agent causing defect rate to increase
Solution Approach 1:
The bonding agent is segmented into discrete bonding protrusions rather than a continuous layer. This segmentation allows the transfer member to be reused multiple times without foreign substances accumulating across the entire bonding surface, as each protrusion can be individually cleaned or replaced, thereby maintaining both productivity and reliability
Solution Approach 2:
The bonding protrusions are designed to be replaceable or recoverable components. When foreign substances adhere to the bonding agent during repeated use, the bonding protrusions can be discarded and replaced with fresh ones, or recovered through cleaning processes, allowing the donor to be reused while maintaining low defect rates
2Productivity
If a donor is re-molded continuously, then productivity is maintained, but bonding agent consumption increases causing manufacturing cost to increase
Solution Approach 1:
The bonding agent is formed into discrete protrusions rather than a continuous layer that requires complete re-application during re-molding. This segmentation allows partial reuse of the bonding agent structure, reducing consumption while enabling continuous production
Solution Approach 2:
The bonding protrusions are pre-formed on the transfer member before the transfer process. This preliminary formation allows the bonding agent to be reused across multiple transfer cycles without requiring continuous re-molding and re-application, thereby reducing bonding agent consumption while maintaining continuous productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the efficiency and accuracy of the manufacturing process, reducing manufacturing costs by minimizing defects and bonding agent consumption.
Implementation Method 1
separating the first semiconductor chip from the substrate by irradiating the first semiconductor chip with laser light
Implementation Method 2
separating the first semiconductor chip from the transfer member by irradiating the transfer member with light
Data Source
AI summary
An embodiment provides a display device manufacturing method comprising the steps of: preparing a substrate having a plurality of semiconductor chips arranged thereon (S1); bonding at least one first semiconductor chip of the plurality of semiconductor chips to a transfer member (S2); irradiating laser light to the first semiconductor chip to separate the first semiconductor chip from the substrate (S3); disposing the first semiconductor chip on a panel substrate of a display device by means of the transfer member (S4); and irradiating light to the transfer member to separate the first semiconductor chip from the transfer member (S5), wherein the transfer member comprises: a transfer layer and a bonding layer disposed on one surface of the transfer layer; the bonding layer comprises at least one bonding protrusion; and the first semiconductor chip is bonded to the bonding protrusion in step S2.