Chip Transfer Device Supplementary Gripper Tool
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Solution Overview
Problem
Existing chip transfer systems lack flexibility in handling a broad array of different chips, particularly in providing them as COB or FCOB orientations, and require efficient temporary storage and gripper management during the transfer process.
Innovation Solution
A chip transfer device with rotatable tools and a supplementary tool equipped with additional grippers, allowing for flexible orientation and temporary storage of chips, along with a pneumatic interface for vacuum control and radial drives for gentle handling, enables efficient transfer and storage of chips as COB or FCOB orientations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single gripper type is used for chip handling, then the device complexity is reduced, but the adaptability to handle different chip sizes and orientations is limited
Solution Approach 1:
The patent implements a universal gripper system where a single gripper design can handle multiple chip types and orientations through programmable control. The placement head is equipped with multiple grippers that can be selectively activated based on the specific chip being placed, allowing one physical hardware configuration to serve multiple functions without requiring dedicated grippers for each chip type.
Solution Approach 2:
The system employs dynamic gripper selection and activation during the placement process. The control system can dynamically determine which grippers to use based on real-time requirements for different chip orientations (COB or FCOB) and sizes, allowing the hardware configuration to adapt flexibly without physical reconfiguration.
2Productivity
If chips are temporarily stored on rotatable tools, then the productivity and flexibility of chip transfer are improved, but the device complexity increases due to additional tools and interfaces
Solution Approach 1:
The patent combines the functions of multiple rotatable tools into a single integrated placement head assembly. The first and second rotatable tools with their respective grippers are merged into one unified structure that can perform both COB and FCOB placement operations, reducing the total number of separate tools and interfaces while maintaining all necessary functionality.
Solution Approach 2:
The integrated placement head serves multiple functions by incorporating both COB and FCOB placement capabilities in a single device. The universal design allows the same hardware structure to handle different chip orientations and types through programmable control of its grippers and rotation mechanisms.
3Quantity of substance
If multiple gripper planes are used for temporary storage, then the quantity of chips that can be held temporarily is increased, but the volume and complexity of the tool increase
Solution Approach 1:
The patent implements a nested arrangement where multiple gripper planes are positioned concentrically around the rotation axis. The first and second planes of grippers are arranged at different radial distances and angular positions, allowing them to be nested within the same rotational space. This enables the system to hold multiple chips simultaneously without proportionally increasing the overall tool volume.
Solution Approach 2:
The system utilizes three-dimensional spatial arrangement by distributing grippers across multiple planes at different radial and angular positions. Instead of stacking grippers in a single plane, the invention distributes them through multiple dimensions (radial distance and angular position), efficiently utilizing the available rotational space to increase chip storage capacity without proportionally increasing tool volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances the flexibility and efficiency of chip transfer by providing a broader range of grippers for handling different chip sizes and orientations, ensuring reliable temporary storage and transfer, thereby improving the processing of various chip types.
Implementation Method 1
pneumatic interface for vacuum control
Data Source
AI summary
A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.