Chip Tray Clip and Lid Structure for Uniform Pressure Retention
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Solution Overview
Problem
Conventional chip tray systems experience part migration and damage due to non-uniform pressure and warpage, leading to lower yields and reduced component longevity during transportation and handling, especially for fragile semiconductor devices.
Innovation Solution
A clip system with integral side and rear walls, a shock-absorbing layer, and an electrostatic dissipative layer integrated into the lid, providing uniform compression and secure retention of the lid on the chip tray to prevent migration and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a traditional hard plastic lid with adhered rigid foam portion and electrostatic dissipative sheets is used, then the lid provides cushioning and electrostatic protection, but the parts within the pockets can still move about during shipping and handling due to gaps and spaces caused by flatness tolerances
Solution Approach 1:
The patent applies beforehand cushioning by integrating a compliant foam layer directly into the lid structure during molding, positioned to contact the tray flange. This pre-configured cushioning layer compensates for flatness tolerances and maintains uniform pressure distribution, preventing gaps and spaces that would otherwise allow part migration during shipping and handling.
Solution Approach 2:
The patent employs composite materials by combining a hard plastic lid structure with an integrated compliant foam layer and electrostatic dissipative sheets. This composite construction provides both structural integrity for lid retention and compliant cushioning for uniform pressure distribution, while the electrostatic dissipative layer protects sensitive components.
2Stability of the object's composition
If conventional clips are used to secure the lid, then the lid is retained on the tray, but non-uniform pressure and warpage occur causing parts to migrate out of pockets
Solution Approach 1:
The patent applies parameter changes by modifying the clip structure to include a compliant foam layer that changes the pressure distribution parameters. The foam layer acts as a pressure-equalizing element that transforms non-uniform point contact pressure into uniform distributed pressure across the lid-flange interface, preventing warpage while maintaining secure retention.
Solution Approach 2:
The patent introduces an intermediary compliant foam layer between the clip and the lid flange. This intermediary element mediates the force transmission from the clip to the lid, distributing the retaining force uniformly and preventing direct rigid contact that would cause warpage and part migration.
3Length of moving object
If thin parts (≤0.010″) are used to reduce component size, then device miniaturization is achieved, but the parts become particularly susceptible to migration during transport
Solution Approach 1:
The patent applies beforehand cushioning with a compliant foam layer integrated into the lid structure that provides continuous contact and support to thin parts (≤0.010″). This pre-configured cushioning system prevents migration by maintaining uniform pressure distribution and eliminating gaps, specifically protecting vulnerable thin components during transport without requiring increases in component thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clip system effectively prevents part migration and damage by applying uniform pressure, ensuring the longevity and integrity of semiconductor components during shipping and handling, with no fatigue or breakage issues, even under drop tests and vibration.
Implementation Method 1
A lid system for a chip tray includes a shock-absorbing layer integrated into an interior of the lid
Implementation Method 2
an electrostatic dissipative layer integrated into an interior of the lid
Data Source
AI summary
A clip for retaining a chip tray and lid, including in one example a pair of side walls, a rear wall, an upper peripheral edge extending from an upper section of each of the side walls and the rear wall and defining an upper region open area therebetween. A lower peripheral edge extending from a lower section of each of the side walls and the rear wall and defining a lower region open area therebetween. A front opening configured to receive the chip tray and lid. The chip tray has a plurality of pockets configured to hold the semiconductor devices. In one example the lid includes a shock absorbing layer and an electrostatic dissipative layer integrated into an interior of the lid.