Chip Ultracapacitor Packaging for Reflow-Stable PCB Mounting
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Solution Overview
Problem
Conventional ultracapacitors are too large for compact designs, vulnerable to the reflow process used in soldering electronics, and have limited lifetimes, making them unsuitable for compact, high-power applications on printed circuit boards.
Innovation Solution
A compact ultracapacitor design with a sealed housing, electric double layer capacitor (EDLC) using carbonaceous materials and an ionic liquid electrolyte, integrated with corrosion prevention features and a hermetically sealed envelope to withstand reflow processing and extend operational life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional ultracapacitors are used to provide high power output, then power delivery capability is improved, but device size becomes too large for compact designs
Solution Approach 1:
The patent changes the chemical parameters of the electrolyte by using ionic liquids with specific compositions (mixtures of imidazolium-based ionic liquids and cyclic carbonate solvents) to achieve higher power density in a compact volume. This parameter change enables the ultracapacitor to deliver high power output while maintaining a small form factor suitable for portable electronics.
Solution Approach 2:
The patent employs composite electrode structures combining activated carbon with conductive polymers and carbon nanotubes. This composite material approach increases the effective surface area for charge storage while maintaining electrical conductivity, thereby achieving high power output in a compact device configuration.
2Ease of manufacture
If conventional ultracapacitors are exposed to reflow process temperatures, then soldering of circuit board components is enabled, but the ultracapacitor is degraded or destroyed
Solution Approach 1:
The patent changes the thermal parameters of the electrolyte system by selecting ionic liquids with high thermal stability and appropriate boiling points. The specific ionic liquid composition is engineered to remain stable at reflow process temperatures (typically 200-250°C), enabling the ultracapacitor to withstand standard soldering processes without degradation.
Solution Approach 2:
The patent employs a sealed encapsulation design that protects the ionic liquid electrolyte from degradation during reflow processing. The sealing structure acts as a protective barrier, allowing the ultracapacitor to survive the brief exposure to high temperatures during soldering while maintaining its functional integrity.
3Volume of moving object
If conventional ultracapacitors are designed for compact form factors, then device size is reduced, but operational lifetime is limited
Solution Approach 1:
The patent uses composite electrode materials combining activated carbon, conductive polymers, and carbon nanotubes to create a stable electrochemical interface. This composite structure reduces degradation mechanisms and extends operational lifetime while maintaining the compact form factor required for portable electronics applications.
Solution Approach 2:
The patent optimizes the ionic liquid electrolyte composition and electrode surface properties to minimize side reactions and degradation. By carefully selecting ionic liquid components and controlling electrode surface characteristics, the patent extends the operational lifetime of the compact ultracapacitor while maintaining its small size.
4Power
If conventional ultracapacitors are exposed to high temperatures and voltages, then high power delivery is achieved, but performance degradation occurs
Solution Approach 1:
The patent changes the electrochemical parameters of the ionic liquid electrolyte to achieve a wider electrochemical stability window and higher operating voltage. The specific ionic liquid composition enables the ultracapacitor to operate at higher voltages and temperatures while maintaining stable performance and preventing degradation.
Solution Approach 2:
The patent introduces protective coating layers on the electrodes that act as intermediaries between the ionic liquid electrolyte and the electrode materials. These coatings prevent direct contact and potential degradation reactions while allowing ionic transport, thereby maintaining stable performance under high temperature and voltage conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, high-power ultracapacitor with extended operational life, capable of withstanding multiple reflow cycles and maintaining performance under high temperatures and voltages, offering improved energy density and equivalent series resistance.
Implementation Method 1
An electric double layer capacitor (EDLC) (also referred to as an ultracapacitor or supercapacitor) energy storage cell is disposed within a cavity in the body
Implementation Method 2
An electrolyte is disposed within the cavity and wets the electrode layers
Data Source
AI summary
An energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process is disclosed. In some embodiments, the apparatus includes: a sealed housing body (e.g., a lower body with a lid attached thereto) including a positive internal contact and a negative internal contact (e.g., metallic contact pads) disposed within the body and each respectively in electrical communication with a positive external contact and a negative external contact. Each of the external contacts provide electrical communication to the exterior of the body, and may be disposed on an external surface of the body. An electric double layer capacitor (EDLC) (also referred to herein as an “ultracapacitor” or “supercapacitor”) energy storage cell is disposed within a cavity in the body including a stack of alternating electrode layers and electrically insulating separator layers. An electrolyte is disposed within the cavity and wets the electrode layers. A positive lead electrically connects a first group of one or more of the electrode layers to the positive internal contact; and a negative lead electrically connects a second group of one or more of the electrode layers to the negative internal contact.