Chip Shielding Case and Underfill Layout for Smartphone Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation methods in electronic devices, such as mobile phones, are inadequate for managing the increasing heat generated by chips like SOC, DDR, and PMU, leading to performance suppression and user experience issues.
Innovation Solution
Implementing a heat dissipation structure with thermal conductive underfill between chip modules and the main board, along with multiple heat dissipation paths through shielding cases and thermal sheets, allowing heat to be conducted in multiple directions for efficient dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conductive gel or pad is used to conduct heat from chip to shielding frame/screen membrane, then heat dissipation path is established, but heat dissipation capability is insufficient for high-performance chips
Solution Approach 1:
The heat dissipation path is segmented into multiple independent pathways: one through the shielding frame to the screen membrane, another through the vapor chamber, and a third through the thermal conductive underfill to the PCB board. This segmentation allows heat to be distributed and dissipated through multiple channels simultaneously, increasing overall heat dissipation capability.
Solution Approach 2:
The invention adds a vertical heat dissipation dimension by introducing thermal conductive underfill between the chip and the PCB board. This creates a third-dimensional heat dissipation path (from chip bottom to board) in addition to the traditional lateral paths (chip top to screen/rear cover), effectively utilizing spatial dimensions to enhance heat dissipation efficiency.
2Temperature
If thermal conductive underfill with high thermal conductivity is used between chip module and main board, then heat dissipation capability is improved, but device structure complexity increases
Solution Approach 1:
The thermal conductive underfill serves multiple functions simultaneously: it provides thermal conduction for heat dissipation, mechanical support for the chip module, and electrical insulation between the chip and board. The shielding frame also serves dual purposes of electromagnetic shielding and heat conduction. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting structural complexity increase.
3Temperature
If multiple heat dissipation paths are implemented through underfill and shielding case, then heat dissipation efficiency is enhanced, but manufacturing complexity increases
Solution Approach 1:
The thermal conductive underfill is pre-applied to the PCB board or chip substrate before chip mounting. This preliminary action ensures proper positioning and thermal contact, and allows the underfill to be cured or set in advance, simplifying the subsequent assembly process and reducing manufacturing complexity despite the added heat dissipation functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by conducting heat in multiple directions, reducing chip heat generation, facilitating performance release, and improving user experience.
Implementation Method 1
thermal conductivity of the thermal conductive underfill is greater than or equal to 0.5 w/m·K
Implementation Method 2
a heat conduction layer is formed between the first chip module and the first shielding case, and between the first shielding case and the display screen
Implementation Method 3
a thermal conductive underfill that wraps the solder ball is filled between the first chip module and the main board
Data Source
Figure 1
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AI summary
This application provides an electronic device, and the electronic device includes: a display screen; a rear cover; a middle frame, located between the display screen and the rear cover, where the display screen and the rear cover are mounted on the middle frame; a main board, mounted on the middle frame, and located between the display screen and the rear cover; a first chip module, welded on a first surface of the main board by using a solder ball; and a first shielding case, located on the first surface of the main board, and shielding the first chip module, where a heat conduction layer is formed between the first chip module and the first shielding case, and between the first shielding case and the display screen; and a thermal conductive underfill that wraps the solder ball is filled between the first chip module and the main board, and thermal conductivity of the thermal conductive underfill is greater than or equal to 0.5 w/m·K. In this application, a heat dissipation path of a chip may be added, which helps dissipate heat of the chip as quickly as possible, thereby improving a heat dissipation capability of the chip, facilitating performance release for the chip, and enhancing user experience.