Semiconductor Chip Vapor Chamber Cooling to Prevent Bubble Adsorption
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Solution Overview
Problem
Existing cooling systems for semiconductor devices face efficiency issues due to bubble adsorption on heating surfaces, which reduces cooling performance and can lead to hot spots.
Innovation Solution
A semiconductor device employing a two-phase liquid cooling structure with a vapor chamber and wick structures that utilize capillary action to move the coolant, eliminating the need for additional power to move the cooling fluid and enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional liquid cooling system is used, then heat dissipation is achieved, but cooling efficiency decreases due to bubble adsorption on heating surfaces
Solution Approach 1:
The invention extracts and removes bubbles from the heating surface by providing a dedicated bubble removal structure that separates the liquid flow path into a cooling region and a bubble removal region, preventing bubbles from adhering to and reducing heat transfer efficiency on the heating surface
Solution Approach 2:
The invention introduces an intermediary bubble removal structure that acts as a mediator between the cooling fluid and the heating surface, capturing and removing bubbles before they can adsorb onto the heating surface, thus maintaining effective heat transfer
2Ease of operation
If a pump is used to move cooling fluid, then coolant circulation is achieved, but additional power consumption is required
Solution Approach 1:
The invention enables the cooling system to move coolant automatically without external power input by utilizing natural convection currents generated by temperature differences and capillary action in the wick structures, allowing the system to serve itself
Solution Approach 2:
The invention replaces the mechanical pump system with a passive fluid transport mechanism based on natural convection and capillary action, eliminating the need for mechanical components that consume electrical power
3Temperature
If single-phase liquid cooling is used, then cooling is achieved, but heat processing range is limited
Solution Approach 1:
The invention utilizes phase transitions of the cooling fluid, allowing it to transition between liquid and vapor phases during the cooling process, thereby expanding the heat processing range and enabling effective cooling at higher temperatures where single-phase liquid cooling becomes less effective
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-phase liquid cooling system effectively prevents a decrease in cooling efficiency caused by bubble adsorption, maintains uniform cooling performance, and reduces thermal resistance near the heat source, thereby enhancing the overall cooling efficiency of semiconductor devices.
Implementation Method 1
first wick structures on a bottom of the cooling channel that is parallel to the upper surface of the semiconductor chip in a transverse direction, the first wick structures configured to move the liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel
Implementation Method 2
Two-phase liquid cooling methods may be used to process heat in a wider range than single-phase liquid cooling methods
Implementation Method 3
a vapor chamber above the semiconductor chip and in fluid communication with the cooling channel
Data Source
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AI summary
A semiconductor device includes a semiconductor chip having a semiconductor integrated circuit. A cooling channel is formed in the semiconductor chip. At least a portion of the cooling channel is formed in the semiconductor chip. First wick structures may be arranged on a bottom of the cooling channel that is parallel to an upper surface of the semiconductor chip in a transverse direction. The first wick structures may move a liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel. Second wick structures may be arranged along an inner surface of the vapor chamber and may move the liquid coolant by capillary action in the transverse direction along the inner surface of the vapor chamber.