Liquid Ejection Chip Wafer Layout for Adhesive Overflow Control
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Solution Overview
Problem
The presence of adhesive agent in groove portions during the cutting of substrates for liquid ejection chips can lead to pieces of adhesive agent sticking out and interfering with adjacent chips, resulting in decreased process yield.
Innovation Solution
A wafer design with grooves and openings that allow adhesive agent to accumulate at step portions away from the groove bottoms, preventing it from protruding and interfering with adjacent chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is cut along the groove where adhesive agent has entered, then the cutting process can proceed, but pieces of adhesive agent remain at the cutting portion and interfere with adjacent liquid ejection chips
Solution Approach 1:
The invention extracts the adhesive agent from the groove portion by providing an opening in the second substrate that exposes the groove. This allows the adhesive agent to be removed or controlled before cutting, preventing it from interfering with adjacent chips while maintaining the bonding function where needed.
Solution Approach 2:
The invention performs preliminary action by forming the opening in the second substrate before the cutting process. This preliminary exposure of the groove allows adhesive agent management to occur prior to cutting, preventing the harmful effect of adhesive remnants on adjacent chips while ensuring proper bonding has already occurred.
2Strength
If adhesive agent accumulates at the groove bottom, then bonding strength is maintained, but it protrudes from the cutting portion and interferes with adjacent chips
Solution Approach 1:
The opening in the second substrate extracts or removes the adhesive agent from the groove bottom area. By exposing the groove through the opening, the adhesive agent can be controlled to remain in the bonding interface rather than protruding from the cutting portion, thus maintaining bonding strength while eliminating interference with adjacent chips.
Solution Approach 2:
The invention applies local quality by creating a localized opening only in the region where adhesive agent needs to be managed. The opening is positioned to expose the groove and control adhesive agent location, allowing different regions of the substrate to have different properties - bonded areas maintain adhesive while the opening region allows adhesive removal or control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents adhesive agent from forming on the side surfaces of liquid ejection chips, thereby maintaining chip alignment and improving manufacturing yield.
Implementation Method 1
an adhesive agent accumulation portion at which the adhesive agent coming out of a gap between the first substrate and the second substrate accumulates and stays away from a bottom of the groove
Data Source
AI summary
An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.