Chip-to-Wafer Structure With Semiconductor Heat-Spreading Layer
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Solution Overview
Problem
Existing chip-to-wafer (C2W) structures suffer from poor heat dissipation, which limits their performance in 3D-IC technology.
Innovation Solution
A C2W structure is designed with a second semiconductor substrate covering the chips and dielectric layer, featuring trenches in both the substrate and dielectric layer to enhance heat dissipation. The second semiconductor substrate provides several times better heat dissipation properties than the dielectric layer alone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a dielectric layer is used to cover the first semiconductor substrate in C2W structure, then the structure is simplified and manufacturing is easier, but heat dissipation performance deteriorates
Solution Approach 1:
The patent combines dielectric layer with semiconductor substrate to create a composite structure. The second semiconductor substrate is bonded to the first semiconductor substrate through the dielectric layer, forming a hybrid structure that leverages the electrical insulation properties of the dielectric while utilizing the superior thermal conductivity of semiconductor materials for heat dissipation.
Solution Approach 2:
The dielectric layer serves as an intermediary between the two semiconductor substrates. It provides electrical isolation while allowing thermal management through the bonded semiconductor structures. The intermediary layer enables both electrical functionality and thermal management in the heterogeneous integration.
2Device complexity
If existing C2W structure is used, then manufacturing process is simpler, but heat dissipation capability is insufficient
Solution Approach 1:
The patent divides the heat dissipation function into separate components: the dielectric layer provides structural support and electrical isolation, while the second semiconductor substrate specifically handles thermal management. This segmentation allows each component to be optimized for its specific function while maintaining manufacturing feasibility.
Solution Approach 2:
The second semiconductor substrate serves multiple functions: it provides mechanical support, enables electrical connections through bonding, and critically, provides enhanced heat dissipation capability. This multi-functionality reduces the need for additional dedicated heat dissipation components, keeping the manufacturing process relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The C2W structure achieves greatly improved heat dissipation performance, allowing for more efficient thermal management in 3D-IC applications.
Implementation Method 1
the second semiconductor substrate covering the plurality of chips and the dielectric layer provides heat dissipation properties several times better than the dielectric layer
Data Source
AI summary
A chip-to-wafer (C2W) structure and a method for making the C2W structure are disclosed. The C2W structure includes a first semiconductor substrate, a plurality of chips located above the first semiconductor substrate, a dielectric layer covering the first semiconductor substrate and a second semiconductor substrate covering the plurality of chips and the dielectric layer. The C2W structure has greatly improved heat dissipation performance.