Semiconductor Chip Warp Suppression for Stable Direct Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The direct bonding method of semiconductor chips to a base member can lead to warping, causing defects such as cracking and chipping, especially when the semiconductor chip thickness is reduced, resulting in a decrease in manufacturing yield.
Innovation Solution
A semiconductor device with a multilayer wiring layer that includes a warp suppression film or portion, selectively provided on the peripheral edge or back surface of the semiconductor chip, to prevent warping and enhance bonding stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the semiconductor chip thickness is reduced to decrease device thickness, then the device thickness is reduced, but the chip rigidity becomes weak and floating occurs easily
Solution Approach 1:
A warp suppression film is formed on the semiconductor chip before bonding to the base member. This preliminary action prevents warping from occurring during the bonding process, allowing the chip to maintain sufficient rigidity even with reduced thickness. The film is applied in advance to counteract the warping tendency that would otherwise cause floating and bonding defects.
2Ease of manufacture
If direct bonding is performed without warp suppression, then the bonding process is simple, but warping causes defects such as cracking and chipping
Solution Approach 1:
A warp suppression film is introduced as an intermediary layer between the semiconductor chip and the bonding process. This film acts as a mediator that prevents warping-induced defects during bonding, thereby improving bonding accuracy without significantly complicating the manufacturing process. The film is a simple additional layer that can be integrated into existing fabrication workflows.
3Volume of moving object
If the chip is thin to reduce device size, then the device is more compact, but floating occurs easily due to weak rigidity
Solution Approach 1:
The warp suppression film is formed on the chip before bonding to provide preliminary stabilization. This preliminary reinforcement allows the thin chip to maintain its structural stability during bonding and operation, preventing floating that would otherwise occur due to the reduced thickness. The film is applied in advance to ensure the chip can withstand bonding stresses.
4Reliability
If warp suppression film is added to prevent floating, then bonding stability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The warp suppression film serves as a simple intermediary element that significantly improves bonding stability. While it does add one more process step (film formation), the overall complexity increase is minimal compared to the substantial improvement in bonding reliability. The film can be formed using standard thin-film deposition techniques that are already prevalent in semiconductor manufacturing.
Data Source
AI summary
To improve a manufacturing yield. A semiconductor device includes: a base member having a first bonding surface; and a semiconductor chip having a second bonding surface having a quadrangular shape, and the second bonding surface of the semiconductor chip and the first bonding surface of the base member are bonded by direct bonding. Then, the semiconductor chip includes a multilayer wiring layer including the second bonding surface, and a semiconductor layer provided on an opposite side to a side of the second bonding surface of the multilayer wiring layer. Then, the multilayer wiring layer includes a warp suppression film that extends along at least one side of the second bonding surface and suppresses warp of the semiconductor chip.