Chip Warpage Modulation Structure for Thin Package Alignment
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Solution Overview
Problem
The mismatch in warpage degrees between chips and substrates due to differing coefficients of thermal expansion (CTE) leads to welding failures in chip packaging, particularly as chips and substrates become thinner, limiting the effectiveness of conventional modulation methods.
Innovation Solution
A chip packaging apparatus with a warpage modulation structure having a higher CTE than the chip, such as a polymer layer, is applied to the surface opposite the substrate, modulating the chip's warpage to align with the substrate's warpage degree, using layer-shaped, strip-shaped, or mesh-shaped structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate is made thinner to reduce overall packaging thickness, then the packaging becomes thinner, but the warpage mismatch between chip and substrate becomes more serious
Solution Approach 1:
The patent applies local quality by introducing a warpage modulation structure with specific material properties (higher CTE than the chip) at a specific location (opposite surface of the chip). This localized structural modification creates non-uniform thermal expansion characteristics that precisely counterbalance the warpage mismatch caused by thinning, allowing the packaging to be thinner while maintaining warpage compatibility between chip and substrate.
2Manufacturing precision
If conventional substrate modulation methods are used (modulating thickness of SR layer, copper layer, and dielectric layer), then substrate warpage can be adjusted, but the ability to properly modulate warping is limited due to reduced substrate thickness
Solution Approach 1:
The patent introduces a warpage modulation structure as an intermediary element that mediates the warpage mismatch problem. This structure, made of polymer material with higher CTE than the chip, serves as a thermal expansion mediator that actively compensates for the warpage difference between chip and substrate, providing enhanced modulation capability beyond what conventional substrate layer thickness adjustments can achieve.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The warpage mismatch between the chip and substrate is alleviated, reducing the likelihood of welding failures and overall warpage in the chip packaging apparatus.
Implementation Method 1
a coefficient of thermal expansion of the warpage modulation structure is greater than a coefficient of thermal expansion of the chip... in a reflow process of the chip packaging apparatus, the warpage modulation structure disposed on the surface that is of the chip and that is opposite to the substrate is expanded with heat
Data Source
AI summary
A chip packaging apparatus and a preparation method thereof are provided, to modulate warpage of a chip, thereby resolving a problem of mismatch between a warpage degree of the chip and a warpage degree of a substrate. The chip packaging apparatus includes a chip, a substrate, and a warpage modulation structure, where a surface that is of the chip and that faces the substrate is electrically connected to the substrate, the warpage modulation structure is disposed on a surface that is of the chip and that is opposite to the substrate, and a coefficient of thermal expansion of the warpage modulation structure is greater than a coefficient of thermal expansion of the chip.