Chip Support Substrate Wedging Elements for Parallel Mounting
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Solution Overview
Problem
Conventional electronic device packaging faces challenges in maintaining the uniform orientation of electronic chips with respect to the mounting face, particularly when the bonded surface is small, leading to potential inclination issues that are critical for optical elements requiring precise orientation.
Innovation Solution
The use of wedging elements projecting from the mounting face of the support substrate to securely hold the electronic chip in place, utilizing existing materials and manufacturing methods such as wire bonds, stud bumps, or resin solder masks to create contact areas that support the chip and maintain its parallel position during adhesive drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If microspheres are used to support the electronic chip, then the chip can be held parallel to the mounting face, but the distribution of microspheres may not be uniform leading to inclination of the chip
Solution Approach 1:
The support function is segmented into multiple discrete contact areas distributed on the mounting face. Instead of relying on a uniform distribution of microspheres, the invention uses separate, localized support structures (such as raised adhesive regions or discrete particles at specific positions) that collectively provide stable support. This segmentation allows each contact area to be independently controlled for position and height, ensuring uniform chip support and preventing inclination.
Solution Approach 2:
The support structures are prepared in advance on the mounting face before the chip is placed. The contact areas are pre-formed with controlled positions and heights, so that when the chip is mounted, it automatically finds the correct parallel position without requiring perfect uniformity of a continuous support layer. This preliminary preparation eliminates the need for real-time adjustment during bonding.
2Area of stationary object
If the bonded surface is small, then the device size is reduced, but the inclination of the electronic chip becomes more significant
Solution Approach 1:
Instead of attempting to provide uniform support across the entire small bonded surface, the invention concentrates support function at specific localized contact areas. These discrete support points are strategically positioned to provide adequate stability even when the overall bonded area is small. The local quality of support (height, position, stiffness) is optimized at each contact area rather than averaging it across the whole surface.
Solution Approach 2:
The invention transitions from a two-dimensional uniform support layer to a three-dimensional arrangement of discrete contact areas with controlled heights. By adding the vertical dimension to the support structure design, the system can provide adequate support leverage with fewer contact points, maintaining chip orientation precision even on small bonded surfaces.
3Ease of manufacture
If conventional adhesive alone is used, then the manufacturing process is simple, but the chip inclination cannot be controlled during adhesive drying
Solution Approach 1:
The invention merges the adhesive function with the support function into a single integrated structure. The adhesive layer is formed with raised regions or embedded particles that simultaneously provide bonding and mechanical support. This combination eliminates the need for separate support structures while maintaining manufacturing simplicity, as the dual-function adhesive can be applied in a single step using conventional dispensing techniques.
Solution Approach 2:
The adhesive material is designed to perform multiple functions: chemical bonding between chip and substrate, mechanical support during drying, and potentially electrical insulation or thermal management. This multi-functionality is achieved by modifying the adhesive formulation or application pattern rather than adding separate components, thus maintaining process simplicity while improving chip position stability.
Data Source
AI summary
Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.