Microelectronic Chip Wire Assembly Using Temporary Cover Grooves
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Solution Overview
Problem
The existing methods for assembling microelectronic chips on wire elements are restrictive in terms of chip shape and structural configuration, making precise and reliable wire placement challenging, especially in industrial contexts requiring high manufacturing rates.
Innovation Solution
A method involving applying a removable cover to form temporary lateral grooves on the chip, inserting the wire, fixing it using pads and localized heating, and then removing the cover, which relaxes shape constraints and allows precise wire fixation without the need for specific grooves on the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If grooves are formed on the chip side faces by assembly or etching, then precise wire positioning and reliable assembly are achieved, but the chip structural configuration becomes restrictive and complex
Solution Approach 1:
A positioning element is introduced as an intermediary component between the chip and the wire. This positioning element has a first face that contacts the chip and a second face that contacts the wire, mediating the positioning function without requiring complex grooves on the chip itself. The positioning element simplifies the chip structure while maintaining precise wire positioning capability.
2Reliability
If grooves are formed on the chip to insert wires, then reliable wire fixation is achieved, but the manufacturing process becomes delicate and time-consuming
Solution Approach 1:
The positioning element is prepared in advance with its positioning features (such as recesses or grooves on its second face) before the assembly process. This preliminary preparation allows the wire to be quickly inserted and fixed without requiring time-consuming groove formation on the chip during manufacturing, thereby improving production rate while maintaining fixation reliability.
3Manufacturing precision
If the chip shape is constrained to accommodate wire insertion grooves, then precise wire placement is enabled, but the adaptability of chip design is reduced
Solution Approach 1:
The positioning function is segmented from the chip structure and transferred to a separate positioning element. This segmentation allows the chip to maintain its standard shapes and designs without modification, while the positioning element provides the necessary wire placement precision. The chip and positioning element are assembled together to achieve the final wire positioning function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and reliable assembly of microelectronic chips on wire elements, improving manufacturing efficiency by allowing flexible chip shapes and ensuring secure wire attachment.
Implementation Method 1
a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form with the first face at least one temporary lateral groove
Implementation Method 2
the fixing step comprises a sequence of localized heating near the temporary groove, to melt the stud against the wire element
Implementation Method 3
to melt the stud against the wire element
Data Source
Figure 1a~1c
Figure 2a~3
Figure 4a~4c
AI summary
The invention relates to a method for joining a microelectronic chip (1) to at least one wire element (7a, 7b). The joining method comprises: • a first step of applying a cover (5) to a first face of the microelectronic chip (1), the cover (5) being configured to form, with the first face (11), at least one temporary side groove; • a step of inserting the wire element (7a, 7b) into the temporary groove; • a step of attaching the wire element (7a, 7b) to the microelectronic chip (1); • a step of removing the cover (5) from the microelectronic chip (1).