Semiconductor Chip Wire Insertion Using a Meltable Bonding Pad
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for inserting wires into semiconductor chip grooves require significant effort, which can lead to wire weakening or breakage, and are sensitive to precise dimension adjustments, making them inefficient in high-production industrial contexts.
Innovation Solution
A method involving a bonding material pad with a low melting point in the chip grooves, where the wire is pressed against the pad and heated above the melting point to melt and secure the wire in place, reducing the need for forceful insertion and allowing for simultaneous assembly without excessive effort.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If significant effort is applied to embed the wire in the groove, then the wire is securely inserted, but the wire may be weakened or broken
Solution Approach 1:
The invention changes the physical state of the bonding material from solid to liquid by heating it above its melting point, transforming the insertion mechanism from mechanical force to thermal-fluid action. This allows the wire to be inserted into the molten bonding material without applying significant mechanical effort, thereby preventing wire weakening or breakage while ensuring secure insertion.
Solution Approach 2:
The invention replaces the mechanical insertion system (applying force to push the wire into the groove) with a thermal system (heating the bonding material to melt it). The wire is then inserted into the molten bonding material which naturally flows and secures the wire without requiring excessive mechanical force, thus resolving the contradiction between insertion security and wire strength preservation.
2Reliability
If precise dimension adjustment of groove and wire is made, then the assembly is robust, but the process is sensitive and complex
Solution Approach 1:
By changing the bonding material to a state with low melting point, the invention creates a tolerance-absorbing mechanism. The molten state allows the wire to be inserted without precise dimensional matching, as the liquid material flows to accommodate slight variations in groove and wire dimensions, then solidifies to create a robust assembly. This reduces sensitivity to dimensional adjustments while maintaining assembly robustness.
Solution Approach 2:
The bonding material acts as an intermediary that mediates between the wire and groove. In its molten state, it provides a forgiving interface that accommodates dimensional variations, eliminating the need for precise dimensional adjustment. After solidification, it creates a strong mechanical bond, thus achieving robust assembly without complex dimension control.
3Reliability
If forceful insertion is used to embed the wire, then the wire is securely fixed, but the production rate decreases
Solution Approach 1:
The invention replaces the slow, forceful mechanical insertion process with a faster thermal process. By heating the bonding material to melt it, the wire can be inserted quickly without the need for prolonged application of force. The molten material rapidly solidifies to secure the wire, significantly reducing the insertion time and increasing production rate while maintaining fixation security.
Solution Approach 2:
The invention utilizes the phase transition of the bonding material from solid to liquid and back to solid. The melting phase allows rapid wire insertion without mechanical force, and the subsequent solidification phase quickly secures the wire. This phase transition mechanism enables both secure fixation and high production rate by eliminating the time-consuming forceful insertion step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient and robust wire-chip assembly with reduced mechanical stress on the wire, enabling higher production rates and improved assembly quality by minimizing the force required for insertion and ensuring a secure bond.
Implementation Method 1
exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt
Data Source
AI summary
A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.